研究業績


論文/学術雑誌

  1. 菊田米男、荒木孝雄、廣瀬明夫、姜英秀, 「連続鋳造過程を経たＴＭＣＰ鋼の低温割れに及ぼす板厚中央偏析の影響」: 溶接学会論文集, 2(1984), pp.383-389
  2. 菊田米男、荒木孝雄、廣瀬明夫、牧野謙二, 「溶接低温割れにおよぼす非金属介在物の影響（第１報）-溶接低温割れ限界応力に対する検討-」: 溶接学会論文集, 3(1985), pp.379-385
  3. 菊田米男、荒木孝雄、廣瀬明夫、松田英光, 「溶接低温割れにおよぼす非金属介在物の影響（第２報）-水素割れ発生、伝播に対する検討-」: 溶接学会論文集, 3(1985), pp. 385-392
  4. 菊田米男、荒木孝雄、廣瀬明夫、松田英光, 「溶接低温割れにおよぼす非金属介在物の影響（第３報）-非金属介在物の水素トラップ効果に対する検討-」: 溶接学会論文集, 3(1985), pp.489-497
  5. 菊田米男、荒木孝雄、廣瀬明夫、山本善貴, 「非金属介在物のトラップ効果を考慮した水素拡散集積挙動の解析」: 溶接学会論文集, 3(1985), pp.497-504
  6. 菊田米男、荒木孝雄、廣瀬明夫, 「鋼の水素脆性に及ぼす非金属介在物の影響」: 材料, 36(1987), pp.500-505
  7. Yoneo Kikuta, Takao Araki and Akio Hirose, "Effect of Nonmetallic Inclusions on Hydrogen Assisted Cracking": Trans. Japan Welding Society, 19(1988), pp.60-65
  8. 荒木孝雄、廣瀬明夫、内原正人、河野渉、本多啓三、近藤光昇, 「Ti-Ni系形状記憶合金およびその接合部の特性と破面形態」: 材料, 38(1989), pp.478-483
  9. 廣瀬明夫、内原正人、荒木孝雄、本多啓三、近藤光昇, 「TiNi系形状記憶合金のレーザ溶接」: 日本金属学会誌, 54(1990), pp.262-269
  10. 廣瀬明夫、松廣克之、湖東雅弘、小林紘二郎, 「SiC/Ti-6Al-4V FRMの繊維／マトリックス界面反応による強度低下機構」: 材料, 40(1991), pp.77-83
  11. 荒木孝雄、廣瀬明夫、松広克之、湖東雅弘、富田晋也, 「SiC繊維強化Ti基複合材料における繊維／マトリックス界面反応層の生成と破面形態」: 材料, 40(1991), pp.682-688
  12. Akio Hirose, Masahiro Kotoh, Shinji Fukumoto and Kojiro F. Kobayashi, "Diffusion bonding of SiC fibre reinforced Ti-6Al-4V alloy": Materials Science and Technology, 8(1992), pp.811-815
  13. 廣瀬明夫、河野渉、野村大吉、小林紘二郎, 「粉末送給法を用いたレーザクラッディングによる耐摩耗皮膜の形成」: 鉄と鋼, 78(1992), pp.1585-1592
  14. Akio Hirose, Yoshiyuki Matsuhiro, Masahiro Kotoh, Shinji Fukumoto and Kojiro F. Kobayashi, "Laser beam welding of SiC fibre-reinforced Ti-6Al-4V composite": Journal of Materials Science, 28(1993), pp.349-355
  15. 廣瀬明夫、小谷英毅、小林紘二郎, 「Ｎｉ-Ｃｒ-Ａｌ-Ｙ合金レーザクラッディングによる材料表面の機能化」: 鉄と鋼, 79(1993), pp.105-112
  16. Akio Hirose, Tatsuya Ueda and Kojiro F. Kobayashi, "Wear and oxidation properties of titanium aluminides formed on titanium surface by laser alloying": Materials Science and Engineering, A160(1993), pp.143-153
  17. 荒木孝雄、西田稔、廣瀬明夫、矢埜浩史、藤田寛, 「肉盛合金の耐アブレッシブ摩耗特性に及ぼす鉄基粉体-炭化物粉体複合の影響」: 溶接学会論文集、11(1993), pp.149-155
  18. 荒木孝雄、西田稔、廣瀬明夫、石田昭佳、藤田寛, 「肉盛合金の耐アブレッシブ摩耗に及ぼす炭化物粉体の粒径および硅砂粒径の影響」: 溶接学会論文集, 11(1993), pp.320-326
  19. Shinji Fukumoto, Akio Hirose and Kojiro F. Kobayashi, "Application of laser beam welding to joining of continuous fibre reinforced composite to metal": Materials Science and Technology, 9(1993), pp.264-271
  20. Shinji Fukumoto, Akio Hirose and Kojiro F. Kobayashi, "Diffusion bonding of SiC/Ti-6Al-4V composite to Ti-6Al-4V alloy and fracture behaviour of joint": Materials Science and Technology, 9(1993), pp. 520-527
  21. Takao Araki, Minoru Nishida, Akio Hirose, Kouji Yano and Hiroshi Fujita, "Abrasive Wear Resistance of Overlay Composite Alloy with Addition of Carbide Powders": Trans. Japan Welding Society, 24(1993), pp.160-166
  22. Akio Hirose and Kojiro F. Kobayashi, "Surface alloying of copper with chromium by CO2 laser": Materials Science and Engineering, A174(1994), pp.199-
  23. Shinji Fukumoto, Akihiro Kasahara, Akio Hirose and Kojiro F. Kobayashi, "Transient liquid phase diffusion bonding of continuous SiC fibre reinforced Ti-6Al-4V composite to Ti-6Al-4V alloy": Materials Science and Technology, 10(1994), pp.807-812
  24. 廣瀬明夫、小林紘二郎, 「CO2レーザ合金化法によるCu表面の機能化」: 伸銅技術研究会誌, 33(1994), pp.182-188
  25. Akio Hirose, Yoshihiro Arita and Kojiro F. Kobayashi, "Microstructure and crack sensitivity of laser-fusion zones of Ti-46mol%Al-2mol%Mo alloy": Journal of Materials Science, 30(1995), pp.970-979
  26. Akio Hirose and Kojiro F. Kobayashi, "Formation of hybrid clad layers by laser processing": ISIJ International, 35(1995), pp.757-763
  27. Shinji Fukumoto, Akio Hirose and Kojiro F. Kobayashi, "An Effective Joint of Continuous SiC/Ti-6Al-4V Composites by Diffusion Bonding": Composites Engineering, 5(1995), pp.1081-1089
  28. Akio Hirose, Daisuke Ozamoto, Ryoji Aoki and Kojiro F. Kobayashi, "Formation of Ceramics Particulate Reinforced TiAl Intermetallic Compound Composites by Plasma Transferred Arc Process": Zeitschrift fur Metallkunde, 86(1995), pp.580-584
  29. Akio Hirose, Shinji Fukumoto and Kojiro F. Kobayashi, "Joining Processes for Structural Application of Continuous Fiber Reinforced MMCs": Key Engineering Materials Vol.104-107, "Metal Matrix Composites", Editors: G.M.Newaz, H.Neber-Aeschbacher and F.H.Wohlbier, Trans Tech Publications Ltd, Switzerland, (1995), pp.853-872
  30. 廣瀬明夫、有田吉宏、小林紘二郎,「TiAl金属間化合物のレーザ溶融加工における溶融凝固部の組織変化と機械的特性」: 材料, 44(1995), pp.1145-1150
  31. Shinji Fukumoto, Kenichi Imamura, Akio Hirose and Kojiro F. Kobayashi, "Study on transient liquid phase bonding process in SiC fiber reinforced Ti-6Al-4V composites": ISIJ International, 35(1995), pp.1307-1314
  32. Akio Hirose, Yoshihiro Arita, Yasumasa Nakanishi and Kojiro F. Kobayashi, "Decrease in Hydrogen Embrittlement Sensitivity of INCONEL 718 by Laser Surface Softening": Materials Science and Engineering, A219(1996), pp.71-79
  33. Akio Hirose, Kazuhiro Abotani, Ryoji Aoki and Kojiro F. Kobayashi, "Properties of NbC/TiAl and TiB2/TiAlproduced by plasma transferred arc processing": Materials Science and Technology, 12(1996), pp.1057-1063
  34. Keizoh Honda, Akio Hirose and Kojiro F. Kobayashi, "Properties of titanium-aluminide layer formed by low pressure plasma spraying": Materials Science and Engineering A222(1997), pp.212-220
  35. Akio Hirose, Keizoh Honda and Kojiro F. Kobayashi,"Properties of in-situ nitride reinforced titanium-aluminide layers formed by reactive low pressure plasma spraying with nitrogen gas": Materials Science and Engineering A222(1997), pp.221-229
  36. Shinji Fukumoto, Akio Hirose and Kojiro F. Kobayashi, "Evaluation of the strength of diffusion bonded joints in continuous fiber reinforced metal matrix composites": Journal of Materials Processing Technology 68(1997), pp.184-191
  37. Akio Hirose, Hirotaka Todaka and Kojiro F. Kobayashi, "CO2 Laser Beam Welding of 6061-T6 Aluminum Alloy Thin Plate": Metallurgical and Materials Transactions, 28A(1997), pp.2657-2662
  38. 廣瀬明夫、福本信次、小林紘二郎, 「中間層を用いたSiC連続繊維強化Ti-6Al-4V合金複合材料の接合」: 金属学会誌 61(1997), pp.1168-1174
  39. Akio Hirose, Mitsuo Hasegawa and Kojiro F. Kobayashi, "Microstructure and Mechanical Properties of TiB2 Particle Reinforced TiAl Composites by Plasma Arc Melting Process": Materials Science and Engineering, A239-240(1997), pp.46-54
  40. Akio Hirose, Makoto Nojiri, Hirotake Ito and Kojiro F. Kobayashi, "Brazing of Ti Alloys with Ti-Zr-Cu Amorphous Filler Metal": International Journal of Materials and Product Technology, 13(1998), Nos.1/2, pp.13-27
  41. Akio Hirose, Kentaro Sakata and Kojiro F. Kobayashi, "Microstructure and Mechanical Properties of Laser Beam Welded Inconel 718": International Journal of Materials and Product Technology, 13(1998), Nos.1/2, pp.28-44
  42. Akio Hirose, Hirotaka Todaka, Hiroto Yamaoka, Mobutaka Kurosawa and Kojiro F. Kobayashi, "Quantitative Evaluation of Softened Regions in Weld Heat-Affected Zones of 6061-T6 Aluminum Alloy - Characterizing of the Laser Beam Welding Process": Metallurgical and Materials Transactions A, 30A(1999), pp.2115-2120
  43. 廣瀬明夫、山岡弘人、黒澤伸隆、小林紘二郎,「A6061-T6アルミニウム合金レーザー溶接部の特性」: 軽金属溶接 37(1999), pp.397-405
  44. 廣瀬明夫、小林紘二郎,「熱処理型Al合金へのレーザー溶接の適用と溶接部の特性評価」: レーザ協会誌, 24(1999), pp.46-53
  45. 廣瀬明夫、野尻誠、伊藤大岳、小林紘二郎,「イオンビームスパッタリング法により形成したAg-Cu合金薄膜を用いたTiの接合」, 材料, 49 (2000), pp.767-773
  46. 山岡弘人、土屋和之、廣瀬明夫、小林紘二郎,「Al-Mg-Si系合金レーザ溶接部における時効処理に関する研究　-Al-Mg-Si系合金のCO2レーザ溶接（第２報）-」: 溶接学会論文集, 18(2000), pp.431-437
  47. Akio Hirose, Kazuhiro Abotani and Kojiro F. Kobayashi, "In-Situ Formation of Nitride Particle Reinforced Titanium Aluminide by Reactive Plasma Arc Melting Process", Materials Transaction, 42(2001), pp.245-251
  48. Akio Hirose, Toshio Fujii, Takeshi Imamura and Kojiro F. Kobayashi, "Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb-Free Solders": Materials Transaction, 42(2001), pp.794-802
  49. Liufa Liu, Akio Hirose and Kojiro F. Kobayashi, "A Numerical Approach for Predicting the Laser Surface Annealing Process of Inconel 718": Acta Materialia, Vol.50 (2002), pp.1331-1347（４月）
  50. 今村武史，藤井俊夫，廣瀬明夫，小林紘二郎，「鉛フリーはんだを用いたQFP接合部の強度と組織」: エレクトロニクス実装学会, 5(2002), pp.372-378（6月号）
  51. 廣瀬明夫，藤井俊夫，今村武史，小林紘二郎，「鉛フリーはんだと銅電極の界面反応が接合強度に及ぼす影響」： 銅と銅合金, 41(2002), pp.293-298（7月）
  52. 劉六法，廣瀬明夫，小林紘二郎，「Inconel718のレーザー表面溶体化プロセスのモデリングと予測」：材料，51(2002), pp.1030-1037（9月）
  53. Liufa Liu, Akio Hirose and Kojiro F. Kobayashi, "Effect of precipitation phases on the hydrogen embrittlement sensitivity of Inconel 718": Science and Technology of Advanced Materials, 3(2002), pp.335-344 (12月)
  54. Liufa Liu, Akio Hirose and Kojiro F. Kobayashi, "Application of Laser Surface Annealing to Improve the Resistance of Inconel 718 to Hydrogen Embrittlement": Recent Research and Development of Materials Science and Engineering, 1(2002), Transworld Research Network, Kerala, India, pp.599-617
  55. Akio Hirose, Tadamasa Imoto, Daisuke Nakamura and Kojiro F. Kobayashi, "Laser Welding of Single Crystal CMX4 Superalloy": Materials Science Forum, 423-432(2003), pp.4007-4012
  56. Liufa Liu, Katsumi Tanaka, Akio Hirose and Kojiro F. Kobayashi, "Experimental and Numerical Analyses of the Mechanism for Decreasing Hydrogen-Embrittlement Sensitivity of Aged Inconel 718 by Laser Surface Annealing": Journal of Laser Application, 15(2003), No.3, pp.134-144
  57. 平森智幸，伊藤元剛，吉川正雄，廣瀬明夫，小林紘二郎，「無電解Ni-P/AuめっきとSn-Ag系鉛フリーはんだの界面反応と継手強度」：エレクトロニクス実装学会誌, 6(2003), pp.503-508（9月）
  58. Akio Hirose, Hiroto Yanagawa, Eiichi Ide and Kojiro F. Kobayashi, "Joint Strength and Interfacial Microstructure between Sn-Ag-Cu and Sn-Zn-Bi Solders and Cu Substrate": Science and Technology of Advanced Materials, (2003), in press
  59. Hiroaki Iwanishi, Akio Hirose, Kazuki Tateyama, Ikuo Mori and Kojiro F. Kobayashi, "Properties of Quad Flat Package Joints Using Sn-Zn-Bi Solder with Varying Lead-Plating Materilas": Journal of Electronic Materials, 32(2003), No.12 pp.1540-1546
  60. 柳川博人，今村武史，井出英一，廣瀬明夫，小林紘二郎，「Sn-Zn-Bi系鉛フリーはんだとCu電極との界面反応現象の解明」：エレクトロニクス実装学会誌，6(2003), No.1, pp.47-53
  61. Tomoyuki Hiramori，Mototaka Ito， Masaoa Yoshikawa, Akio Hirose and Kojiro F. Kobayashi, "Sn-Ag Based Solders Bonded to Ni-P/Au Plating -Effect of Interfacial Structure on Joint Strength-: Materials Transaction, 44(2003), No.11, pp.2375-2383
  62. Fumiaki Matsui, Masami Shibao, Nobuharu Yoshida, Kimihiro Shibata, Hiroki Sakamoto, Hiroshi Sakurai, Akio Hirose and Kojiro F. Kobayashi, "Property of Laser Welded Bake-Hardening Steel in Tailored Blanks for Automobile", Materials Science Forum, 449-452(2004), pp.397-400
  63. Yousuke Sogo, Takashi Hojo, Hirotaka Iwanishi, Akio Hirose and Kojiro F. Kobayashi, "Influence of Interfacial Reaction Layer on Reliability of CSP Joint Using Sn-8Zn-3Bi Solder and Ni/Au Plating", Materials Transaction, Vol.45 (2004), No.3, pp.734-740
  64. Atsushi Yamaguchi, Yuhei Yamashita, Akio Furusawa, Kazutoshi Nishida, Takashi Hojo, Yosuke Sogo, Ayako Miwa, Akio Hirose and Kojiro F. Kobayashi: “Properties of Solder Joints using Sn-Ag-Bi-In Solder”, Materials Transaction, 45(2004), No.4, pp.1282-1289

  65. 上西啓介，廣瀬明夫，小林紘二郎，「Sn-Ag系鉛フリーはんだ接合部の信頼性に及ぼす銅表面めっきの影響」：銅と銅合金，43(2004), No.1, pp.251-255

  66. Akio Hirose, Fumiaki Matsui, Hiroki Imaeda, Kojiro F. Kobayashi: “Interfacial Reaction and Strength of Dissimilar Joints of Aluminum Alloys to Steels for Automobile”, Materials Science Forum, 475-479(2005), pp.349-352

  67. 山口敦史，山下祐平，古澤彰男，西田一人，北条隆志，十河陽介，三輪綾子，廣瀬明夫，小林紘二郎，「Sn-Ag-Bi-Inはんだを用いたBGA接合部の継手特性と界面組織」：エレクトロニクス実装学会誌, 8(2005), No.1，pp.44-51

  68. 山口敦史，古澤彰男，西田一人，岩西宏昭，北条隆志，十河陽介，廣瀬明夫，小林紘二郎，「Sn-8Zn-3BiはんだとNi/Au めっき電極を用いたCSP 接合部の界面組織と接合信頼性」, 日本金属学会誌，69(2005), No.1, p.132-138

  69. 山口敦史，山下裕平，古澤彰男，西田一人，北条隆志，十河陽介，三輪綾子，廣瀬明夫，小林紘二郎，「Sn-Ag-Bi-In はんだの接合特性」, 日本金属学会誌，69(2005), No.1, pp.139-146
  70. Eiichi Ide, Shinji Angata, Akio Hirose, and Kojiro F. Kobayashi, “Metal-Metal Bonding Process using Ag Metallo-Organic Nanoparticles”: Acta Materialia, 53(2005), pp.2385-2393
  71. Liufa Liu, CQ Zhai, C Lu, WJ Ding, Akio Hirose and Kojiro F. Kobayashi, “Study of the Effect of Delta Phase on Hydrogen Embrittlement of Inconel 718 by Notch Tensile Tests”: Corrosion Science, 47(2005), No.2, pp.355-367
  72. Liufa Liu, CQ Zhai, C Lu, WJ Ding, Akio Hirose and Kojiro F. Kobayashi, “Effect of Delta Phase on Hydrogen Embrittlement of Inconel 718 by Notch Tensile Tests”: Journal of Materials Science and Technology, 21(2005), No.2, pp.256-260
  73. T. Sano, Hiroaki Mori, O Sakata, E. Ohmura, I. Miyamoto, A. Hirose, and K. F. Kobayashi, “Femtosecond laser driven shock quenching of the nanocrystalline high-pressure phase of iron”: Mater. Sci. Forum, 475-479(2005), pp.3475-3478
  74. Akio Hirose and Kojiro F. Kobayashi, “Laser Beam Welding of Automobile Materials for Lightweight Car Body”: Mater. Sci. Forum, 502(2005), pp.487-492

  75. Tomokazu Sano, Masato Yanai, Etsuji Ohmura, Yasumitsu Nomura, Isamu Miyamoto, Akio Hirose and Kojiro F. Kobayashi, “Femtosecond laser fabrication of microspike-arrays on tungsten surface”: Applied Surface Science, 247(2005), pp.340-346.

  76. Tomokazu Sano, Hiroaki Mori, Osami Sakatab, Etsuji Ohmuraa, Isamu Miyamotoa, Akio Hirosea and Kojiro F. Kobayashia, “Femtosecond laser driven shock synthesis of the high-pressure phase of iron”: Applied Surface Science, 247(2005), pp.571-576.

  77. Akio Hirose, Tomoyuki Hiramori, Mototaka Ito, Yoshiharu Tanii, and Kojiro F. Kobayashi, “Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization”: Mater. Sci. Forum, 512(2005), pp.355-360

  78. Eiichi Ide, Shinji Angata, Akio Hirose and Kojiro F. Kobayashi, “Bonding of Various Metals Using Ag Metallo-organic Nanoparticles -A Novel Bonding Process Using Ag Metallo-organic Nanoparticles-“: Mater. Sci. Forum, 512(2005), pp.383-388

  79. Tomokazu Sano, Osami Sakata, Etsuji Ohmura, Isamu Miyamoto, Akio Hirose, Kojiro F. Kobayashi, “Femtosecond Laser Synthesis of the High-Pressure Phase of Iron”: Mater. Sci. Forum, 512(2005), pp.349-354

  80. 井出英一，廣瀬明夫，小林紘二郎，「銀ナノ粒子を用いた高温対応鉛フリー接合プロセス」： 材料, 54(2005) , No.10, pp.999-1004

  81. Atsushi Yamaguchi, Yuhei Yamashita, Akio Furusawa, Kazuto Nishida, Takashi Hojo, Yosuke Sogo, Ayako Miwa, Akio Hirose and Kojiro F. Kobayashi, “Soldering Properties and Interfacial Microstructure of CSP Solder Joints with Lower Melting Lead-free Solder”: Journal of Microelectronics and Electronics Packaging, 2(2005), No.3, pp.208-216

  82. Eiichi Ide, Akio Hirose and Kojiro F. Kobayashi, “Infuence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging”, Materials Transactions, 47(2006), No.1, pp.211-217

  83. Akio Hirose, Hiroki Imaeda, Miki Kondo and Kojiro F. Kobayashi, “Influence of Alloying Elements on Interfacial Reaction and Strength of Aluminum/Steel Dissimilar Joints for Light Weight Car Body”, Materials Science Forum, 539-543(2007), p.3888-3893

  84. Tomokazu Sano, Kengo Takahashi, Akio Hirose and Kojiro F. Kobayashi, “Femtosecond Laser Ablation of Zr55Al10Ni5Cu30 Bulk Metallic Glass”, Materials Science Forum, 539-543 (2007) p.1951-1954

Proceedings

  1. Yoneo Kikuta, Takao Araki and Akio Hirose, "Effect of Nonmetallic Inclusions on HAZ Hydrogen Induced Cracking": The International Conference on Quality and Reliability in Welding, September (1984), Beijing, China, B-6-1-B-6-6
  2. Yoneo Kikuta, Takao Araki, Akio Hirose and Jiang Ying Xiu, "The Effect of Center Segregation of Continuously　Cast TMCP Steels on Weld Cold Cracking": IIW Doc. IX-1405-86 (1986)
  3. Akio Hirose, Takao Araki and Yoneo Kikuta, "Effect of Nonmetallic Inclusions on Behaviour of Hydrogen Diffusion and Hydrogen Assisted Cracking": 4th International Conference on Hydrogen and Materials, May (1988), Beijing, China, pp. 554-561
  4. Takao Araki, Akio Hirose, Masafumi Yoneda and Yoneo Kikuta, "Behaviour of Hydrogen Delayed Cracking at 423K-573K for Pressure Vessel Steel": 4th International Conference on Hydrogen and Materials, May (1988), Beijing , China, pp.725-732
  5. Akio Hirose and Takao Araki, "Effect of Nonmetallic Inclusions on Weld Cold Cracking": International Conference on Evaluation of Materials Performance in Severe Environments, November (1989), Kobe, Japan, pp.865-872
  6. Akio Hirose, Masato Uchihara, Takao Araki, Keizoh Honda and Mitsuaki Kondoh, "Laser Welding of Ti-Ni Type Shape Memory Alloy": 5th International Symposium on Advanced Technology in Welding, Material Processing and Evaluation, April (1990), Tokyo, Japan, pp.687-692
  7. Akio Hirose, Shinji Fukumoto and Kojiro F. Kobayashi, "Joining of SiC Fibre Reinforced Ti-6Al-4V Alloy Composite": Second Canadian International Composites Conference, September (1993), Ottawa, Canada, pp.935-942
  8. Keizoh Honda, Itaru Chida, Akio Hirose and Kojiro F. Kobayashi, "Characteristics of Low Pressure Plasma Sprayed TiAl and the Reactive Spraying": Proceedings of the 6th International Welding Symposium of Japan Welding Society, November(1996), Nagoya, Japan, pp.737-742
  9. Akio Hirose, Mitsuo Hasegawa, Ryoji Aoki and Kojiro F. Kobayashi, "Production of Ceramic Particle Reinforced TiAl Intermetallic Compound Matrix Composites by Plasma Arc Melting Process": Solidification Science and Processing, TMS, Warrendale, PA, (1996), pp.223-230
  10. Akio Hirose, Kentaro Sakata and Kojiro F. Kobayashi, "Laser Beam Welding of Ni-base Superalloy Inconel 718": Proceedings of the 4th Decennial International Conference on Solidification Processing, edited by J. Beech and H. Jones, University of Sheffield, Sheffield, UK, (1997), pp.675-679（７月）
  11. Akio Hirose and Kojiro F. Kobayashi, "Laser Surface Solutionizing of INCONEL 718: Improvement of Resistance to Hydrogen Embrittlement": Proceedings of the Laser Materials Processing Conference ICAREO'98, LIA, Orlando, FL, (1998), Vol.85, Part 2, Section D, pp.41-50（11月）
  12. 藤井俊夫、廣瀬明夫、小林紘二郎, 「Sn-Ag系鉛フリーはんだを用いたマイクロ接合部の組織と強度特性」: Proceedings of Mate 2000, February (2000), Yokohama, JWS, pp.211-216
  13. 森郁夫、藤内伸一、廣瀬明夫、藤本公三、竹本正: 「基本鉛フリー合金材料のリフローソルダリング継手特性」: Proceedings of Mate 2000, February (2000), Yokohama, JWS, pp.355-360
  14. Akio Hirose, Liu Liufa and Kojiro F. Kobayashi, "Laser Surface Annealing of Ni-Base Super Alloy for Enhancement of Material Performance in Hydrogen Environment": First International Symposium on Laser Precision Microfabrication, Proceedings of SPIE Vol.4088 (2000), pp.236-239
  15. Akio Hirose and Kojiro F. Kobayashi, "Evaluation of Fracture Behavior in SiC/Ti-6Al-4V Composites by Acoustic Emission Technique", Proceedings of the 10th International Symposium on Nondestructive Characterization of Materials", pp.61-68
  16. 今村武史、藤井俊夫、廣瀬明夫、小林紘二郎, 「Sn-Ag系鉛フリーはんだを用いたQFPの継手強度に及ぼす界面反応の影響」: Proceedings of Mate 2001, February (2001), Yokohama, JWS, pp.481-486
  17. Liu Liufa, Akio Hirose and Kojiro F.Kobayashi, "Modeling the Laser Surface Annealing Process of Aged Inconel 718", Proc. of 7th International Conference on Today and Tommorow in Science and Technology of Welding and Joining (7WS), 2001, Kobe Japan, (2001), pp.1007-1012
  18. Akio Hirose, Toshio Fujii, Takeshi Imamura and Kojiro F. Kobayashi, "Reliability of Reflow-Soldered Microjoints with Lead Free Solders", Proc. Fourth Pacific Rim Int. Conf. on Advanced Materials and Processing (PRICM4), (The Japan Institute of Metals, 2001) pp.1059-1062
  19. 廣瀬明夫、今村武史、藤井俊夫、小林紘二郎,「鉛フリーはんだとCuとの界面反応現象の検討」： Proc. of 11th Sympo. on Microelectronics (MES2001), 2001, Osaka Japan, (2001) pp.27-30
  20. 今村武史、藤井俊夫、廣瀬明夫、小林紘二郎,「鉛フリーはんだQFP接合部の組織と信頼性」： Proc. of 11th Sympo. on Microelectronics (MES2001), 2001, Osaka Japan, (2001) pp.23-26
  21. 伊藤元剛、吉川正雄、奥野和彦、片桐元、平森智幸、廣瀬明夫、小林紘二郎,「Sn-Ag-X系はんだ(X=Cu,Bi,Au)とAuコートNiメッキの接合界面の反応機構と信頼性の評価」： Proc. 8th Sympo. on Microjoining and Assembly Technologies for Electronics, 2002, (Mate 2002) Yokohama Japan, (2002) pp.231-236
  22. 岩西宏昭、今村武史、廣瀬明夫、小林紘二郎、館山和樹、森郁夫,「Sn-Zn-Biはんだを用いたQFP継手特性に及ぼすリードめっきの影響」： Proc. 8th Sympo. on Microjoining and Assembly Technologies for Electronics, 2002, (Mate 2002) Yokohama Japan, (2002) pp.277-282
  23. 山口敦史、古澤彰男、大谷博之、池田順治、岩西宏昭、北条隆志、廣瀬明夫、小林紘二郎,「Sn-Zn-Biはんだを用いたCSP接合部の組織と継ぎ手特性」, Proc. 8th Sympo. on Microjoining and Assembly Technologies for Electronics, 2002, (Mate 2002) Yokohama Japan, (2002) pp.295-300
  24. Liu Liufa, Akio Hirose and Kojiro F.Kobayashi, "Laser Surface Annealing Technique of Aged Inconel 718 by Laser Beam Irradiation": Proceedings of International Conference on Laser Advanced Materials Processing (LAMP2002)、May.27-31、Osaka, SPIE Vol.4831 (2003) pp.241-246
  25. Nobutaka Kurosawa, Akio Hirose and Kojiro F. Kobayashi, "Strengthening of Ultra-Low Carbon Steels by Laser Melting Treatment": Proceedings of International Conference on Laser Advanced Materials Processing (LAMP2002)、May.27-31、Osaka, SPIE Vol.4831 (2003) pp.386-389
  26. Akio Hirose and Kojiro F. Kobayashi, "Characteristics of Laser Beam Welds of Age-Hardenable 6061-T6 Aluminum Alloy": Proceedings of International Conference on Laser Advanced Materials Processing (LAMP2002)、May.27-31、Osaka, SPIE Vol.4831 (2003) pp.313-318
  27. 柳川博人、今村武史、井出英一、廣瀬明夫、小林紘二郎：「Sn-Zn-Bi系鉛フリーはんだとCu電極との界面反応現象の解明」, Proc. of the 12th Sympo. on Microelectronics (MES2002), 2002, Osaka Japan, (2002) p.191-194.
  28. 井出英一、柳川博人、今村武史、廣瀬明夫、小林紘二郎：「Sn-Sb系高温鉛フリーはんだにおけるCuとの界面反応の基礎的検討」, Proc. of the 12th Sympo. on Microelectronics (MES2002), 2002, Osaka Japan, (2002) p.143-146.
  29. 北条隆志、岩西宏昭、廣瀬明夫、小林紘二郎、山口敦史、古澤彰男、大谷博之、池田順治：「Sn-Zn-Biはんだを用いたCSP実装における継手特性」, Proc. of the 12th Sympo. on Microelectronics (MES2002), 2002, Osaka Japan, (2002) p.187-190.
  30. 平森智幸、廣瀬明夫、小林紘二郎、伊藤元剛、吉川正雄、奥野和彦、片桐元：「Ni/AuめっきとSn-Ag系鉛フリーはんだの界面反応と接合部強度評価」, Proc. of the 12th Sympo. on Microelectronics (MES2002), 2002, Osaka Japan, (2002) p.131-134.
  31. Hiroto Yanagawa, Daisuke Nakamura, Akio Hirose and Kojiro F. Kobayashi: "Laser Welding of Single Crystal Nickel Base Superalloy CMSX-4", Proc. of the International Welding/Joining Conference (IWC-Korea 2002), Oct.28-30, Kyongju Korea、(2002) p.193-198.
  32. Naoharu Yoshida, Masami Shibao, Mitsuhiro Ema, Seiji Sasabe, Akio Hirose and Kojiro F. Kobayasshi: "Effects of Aging Treatment on Microstructure and Strength of Weld Heat Affected Zone of 6N01-T5 Aluminum Alloy", Proc. of the International Welding/Joining Conference (IWC-Korea 2002), Oct.28-30, Kyongju Korea, (2002) p.59-64.
  33. Hiroaki Iwanishi, Takeshi Imamura, Akio Hirose, Kojiro F. Kobayashi, Kazuki Tateyama abd Ikuo Mori: "Interfacial Reaction and Strength of QFP joints Using Sn-Zn-Bi Solder with varying Lead Plating Materials", Proc. of the International Welding/Joining Conference (IWC-Korea 2002), Oct.28-30, Kyongju Korea, (2002) p.481-486. 2
  34. Liufa Liu, Katsumi Tanaka, Akio Hirose and Kojiro F. Kobayashi: "Laser Surface Annealing for Improving Hydrogen Embrittlement Resistance of Aged Inconel 718: Evaluation of the Effects of Precipitates", Proc. of the International Welding/Joining Conference (IWC-Korea 2002)、Oct.28-30, Kyongju Korea, (2002) p.570-576.
  35. Hiroaki Iwanishi, Takeshi Imamura, Akio Hirose and Kojiro F. Kobayashi, Kazuki Tateyama, Ikuo Mori: "Effect of Interfacial Reaction on Strength of Reflow-Soldered Joints Using Lead-free Solders", Proc. of the Inter. Conf. on Designing of Interfacial Structure in Advanced Materials and Their Joints (DIS'02), Nov.26-28 2002, Osaka, (2002), p.728-733.
  36. 伊藤元剛、吉川正雄、中川善嗣、片桐元：「SnAg系鉛フリーはんだとNi/Auめっきのリフロー過程での界面反応におけるAuの挙動」，Proc. 9th Sympo. on Microjoining and Assembly Technologies for Electronics, 2003, (Mate 2003) Yokohama Japan, 9(2003) pp.277-282
  37. 平森智幸、伊藤元剛、谷井義治、廣瀬明夫、小林紘二郎：「Sn-Ag系鉛フリーはんだボールとNi/Auめっきパッドの界面反応層と継手強度」，Proc. 9th Sympo. on Microjoining and Assembly Technologies for Electronics, 2003, (Mate 2003) Yokohama Japan, 9(2003) pp.283-288
  38. 山口敦史、古澤彰男、北条隆志、十河陽介、廣瀬明夫、小林紘二郎：「Sn-Zn-Biはんだを用いたCSP接合部の組織と継手特性－Ni/Auめっきの影響－」，Proc. 9th Sympo. on Microjoining and Assembly Technologies for Electronics, 2003, (Mate 2003) Yokohama Japan, 9(2003) pp.309-314
  39. Mototaka Ito， Masaoa Yoshikawa， Yoshiharu Tanii, Toshihiko Ito, Yoshitugu Nakagawa， Gen Katagiri，Tomoyuki Hiramori，Akio Hirose and Kojiro F. Kobayashi: "The Growth Mechanism of P-rich Layer in Interfacial Reaction during Reflow Process of Sn-Ag-Cu Solder on Ni-Ｐ/Au Plating", Proc. Inter. Conf. Electronic Packaging (ICEP 2003), April 16-18 2003, Tokyo, (2003), in press.
  40. 平森智幸、伊藤元剛、谷井義治、廣瀬明夫、小林紘二郎：「無電解Ni-P/AuめっきパッドSn-Ag系鉛フリーはんだの界面構造と接合部強度」, Proc. of the 13th Sympo. on Microelectronics (MES2003), 2003, Osaka Japan, (2003) p.41-44.
  41. 十河陽介、岩西宏昭、北条隆志、廣瀬明夫、小林紘二郎、山口敦史、古澤彰男、西田一人：「Sn-8Zn-3Biはんだを用いたCSP実装における継手信頼性に及ぼす界面構造の影響」, Proc. of the 13th Sympo. on Microelectronics (MES2003), 2003, Osaka Japan, (2003) p.57-60.
  42. 井出英一、安形真治、廣瀬明夫、小林紘二郎：「銀ナノ粒子を用いた実装プロセスの基礎的検討」, Proc. of the 13th Sympo. on Microelectronics (MES2003), 2003, Osaka Japan, (2003) p.96-99.
  43. 井出英一、安形真治、廣瀬明夫、小林紘二郎：「銀ナノ粒子を用いた接合プロセス－Cuとの接合性の検討－」, Proc. 10th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, (Mate 2004) Yokohama Japan, 10(2004) pp.213-218.
  44. 十河陽介、北条隆志、岩西宏昭、廣瀬明夫、小林紘二郎：「Sn-8Zn-3BiとNi/Auめっきの界面反応に及ぼすリフロー温度の影響」, Proc. 10th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, (Mate 2004) Yokohama Japan, 10(2004) pp.137-142.
  45. 山口敦史、山下裕平、古澤彰男、西田一人、北条隆志、十河陽介、三輪綾子、廣瀬明夫、小林紘二郎：「Sn-Ag-Bi-Inはんだ接合部の継手特性」, Proc. 10th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, (Mate 2004) Yokohama Japan, 10(2004) pp.143-148.
  46. 伊藤元剛、谷井義治、伊藤俊彦、中川善嗣、片桐元、平森智幸、廣瀬明夫，小林紘二郎：「Sn-Ag-Cuはんだと無電解NiP/Auめっき接合体の界面ナノ構造の継手強度への影響」, Proc. 10th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, (Mate 2004) Yokohama Japan, 10(2004) pp.159-164.
  47. 平森智幸、伊藤元剛、谷井義治、廣瀬明夫、小林紘二郎：「Sn-Ag系鉛フリーはんだボールのNi-P/AuめっきCSP接合強度評価」, Proc. 10th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, (Mate 2004) Yokohama Japan, 10(2004) pp.165-170.
  48. T. Sano, M. Yanai, E. Ohmura, Y. Nomura, I. Miyamoto, A. Hirose, and K. F. Kobayashi: “Fabrication of microspike-arrays on tungsten surface using femtosecond laser”, The 5th International Symposium on Laser Precision Microfabrication (LPM2004), Nara, Japan, May 11-14, 2004. Proc. SPIE 5662, pp.760-765

  49. T. Sano, H. Mori, O. Sakata, E. Ohmura, I. Miyamoto, A. Hirose, and K. F. Kobayashi: “Femtosecond laser driven shock quenching of the high-pressure phase of iron”, The 5th International Symposium on Laser Precision Microfabrication (LPM2004), Nara, Japan, May 11-14, 2004 Proc. SPIE 5662, pp.678-683
  50. Akio Hirose, Hiroto Yanagawa, Eiichi Ide, Kojiro F. Kobayashi: “Effect of Interfacial Microstructure on Joint Strength between Sn-Ag-Cu and Sn-Zn-Bi Solders and Cu Substrate”: Proc. Electronics Goes Green 2004+, Sep. 6-8 (2004), Berlin, Germany, pp.363-368

  51. Atsushi Yamaguchi, Yuhei Yamashita, Akio Furusawa, Kazuto Nishida, Takashi Hojo, Yosuke Sogo, Ayako Miwa, Akio Hirose and Kojiro F. Kobayashi, “Reliability of CSP Solder Joints with Lower Melting Lead-free Solder”: Proc. 37th Inter. Sympo. On Microelectronics, (2004), TP4 pp.8-17
  52. 井出英一、安形真治、廣瀬明夫、小林紘二郎，「銀ナノ粒子を用いた接合プロセス-接合パラメータの影響-」：Proc. of the 14th Sympo. on Microelectronics (MES2004), 2004, Osaka, Japan, (2004) pp.193-196

  53. Akio Hirose, Kojiro F. Kobayashi, Tomoyuki Hiramori，Mototaka Ito and Yoshiharu Tanii: “Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn-Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu Land”, Proc. Material Solution Conference and Exposition, Columbus, OH, USA, Oct. 18-21, (2004), in press

  54. T. Katayama, F. Matsui, N. Yoshida, A. Hirose, K. F. Kobayashi, K. Shibata, H. Sakamoto, H. Sakurai and K. Kanamori: “Properties of Weld Joints of Bake-Hardening Steel for Automobile”, Material Solution Conference and Exposition, Columbus, OH, USA, Oct. 18-21, (2004), in press

  55. Eiichi Ide, Shinji Angata, Akio Hirose, and Kojiro F. Kobayashi: “Novel Bonding Process Using Ag Nanoparticles -Influence of Bonding Conditions-“, Proc. Material Solution Conference and Exposition, Columbus, OH, USA, Oct. 18-21, (2004), in press
  56. Yosuke Sogo, Takashi Hojo, Hiroaki Iwanishi, Akio Hirose, Kojiro F. Kobayashi,　Atsushi Yamaguchi, Akio Furusawa and Kazutoshi Nishida, “Interfacial Reaction Between Sn8Zn3Bi and NiAu Plating”: Proc. Material Solution Conference and Exposition, Columbus, OH, USA, Oct. 18-21, (2004), in press
  57. Eiichi Ide, Shinji Angata, Akio Hirose and Kojiro F. Kobayashi: “Bonding of Cu Using Ag Metallo-Organic Nanoparticles”, Proc. International Conf. New Frontiers of Process Science and Engineering in Advanced Materials (PSEA'04, The 14th Iketani Conference) , Nov. 24-26, 2004, Kyoto, Japan, Part2, pp.233-238

  58. 佐野智一、森裕章、坂田修身、大村悦二、宮本勇、廣瀬明夫、小林紘二郎，「フェムト秒レーザーによる鉄の非平衡相合成」：Proc. 11th Sympo. on Microjoining and Assembly Technologies for Electronics, 2005, (Mate 2005) Yokohama Japan, 11(2005) pp.471-476

  59. 井出英一、安形真治、廣瀬明夫、小林紘二郎，「銀ナノ粒子を用いた接合プロセス－各種金属との接合性の検討－」：Proc. 11th Sympo. on Microjoining and Assembly Technologies for Electronics, 2005, (Mate 2005) Yokohama Japan, 11(2005) pp.223-228

  60. 山口敦史、古澤彰男、西田一人、北条隆志、十河陽介、三輪綾子、廣瀬明夫、小林紘二郎，「Sn-Ag-Bi-Inはんだの継手特性に与えるリフロープロファイルの影響」：Proc. 11th Sympo. on Microjoining and Assembly Technologies for Electronics, 2005, (Mate 2005) Yokohama Japan, 11(2005) pp.17-22

  61. Shinji Kobayashi, Eiichi Ide, Shinji Angata, Akio Hirose and Kojiro F. Kobayashi: “The Bondabilities of Various Metals Using Ag Metallo-Organic Nanoperticles and These Bonding Nechanism”, Proc. ASME InterPACK 2005, July 17-22, San Francisco, CA, USA, IPACK2005-73161 on No.1729CD

  62. Shinji Angata, Eiichi Ide, Shinji Kobayashi, Akio Hirose and Kojiro F. Kobayashi: “The Sintering Process of Ag Metallo-Organic Nanoparticles and The Influence of The Joining Parameters upon Cu-to-Co Joining”, Proc. ASME InterPACK 2005, July 17-22, San Francisco, CA, USA, IPACK2005-73164 on No.1729CD

  63. Akio Hirose, Takashi Hojo, Yosuke Sogo, Ryoko Miwa, Kojiro F. Kobayashi, Atsushi Yamaguchi, Akio Furusawa and Kazuto Nishida: “Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder”, Proc. ASME InterPACK 2005, July 17-22, San Francisco, CA, USA, IPACK2005-73167 on No.1729CD

  64. Hiroki Imaeda, Miki Kondo, Akio Hirose and Kojiro F. Kobayashi, “Effect of Interfacial Microstructure on Strength of Dissimilar Joint of Aluminum Alloys and Steels for Light-Weight Auto Body”: Proc. Materials Science & Technology: Joining of Monolithic Structures and Components, September 25-28, 2005, Pittsburgh, PA, USA, pp.17-27
  65. 山口拓人、井出英一、廣瀬明夫、小林絋二郎、山際正憲、村上善則：「銀ナノ粒子を用いた実装プロセスの開発」, Proc. of the 15th Sympo. on Microelectronics (MES2005), 2004, Osaka Japan, (2005) pp.237-240

  66. 尾崎英樹、山本孝志、廣瀬明夫、小林紘二郎、石尾雅昭、塩見和弘、橋本彰夫：「Sn-Agはんだと基板材料との急速化合物化反応によるマイクロ接合部高融点化に関する研究」, Proc. 12th Sympo. on Microjoining and Assembly Technologies for Electronics, 2006, (Mate 2006) Yokohama Japan, 12(2006) pp.149-154

  67. 山口拓人、井出英一、小林真司、廣瀬明夫、小林紘二郎、李正九、森博太郎：「複合型ナノ粒子の焼成機構及び接合プロセスの検討」, Proc. 12th Sympo. on Microjoining and Assembly Technologies for Electronics, 2006, (Mate 2006) Yokohama Japan, 12(2006) pp.371-376

  68. 高橋謙悟、佐野智一、廣瀬明夫、小林紘二郎：「Zr55Al10Ni5Cu30バルク金属ガラスのフェムト秒レーザーアブレーション」, Proc. 12th Sympo. on Microjoining and Assembly Technologies for Electronics, 2006, (Mate 2006) Yokohama Japan, 12(2006) pp.501-504
  69. 佐野智一、山本浩平、廣瀬明夫、小林紘二郎、坂田修身：「フェムト秒レーザー衝撃波によるチタン高圧相合成」, Proc. 12th Sympo. on Microjoining and Assembly Technologies for Electronics, 2006, (Mate 2006) Yokohama Japan, 12(2006) pp.505-510

  70. Akio Hirose, Eiichi Ide, Shinji Angata, Shinji Kobayashi and Kojiro F. Kobayashi: “Characteristics of Bonding Process Using Ag Mettalo-Organic Nanoparticles”, Proceedings of International Conference on Electronics Packaging (ICEP 2006), Tokyo, Japan, pp.59-64

  71. Miki Kondo, Hiroaki Imaeda, Akio Hirose and Kojiro F. Kobayashi: “Effects of Si and Mg on Bondability of Dissimilar Joining of Al alloys to Steel for Light Weight Car Body”, Smart Processing Technology, Vol.1 (2006), Proceedings of International Symposium on Smart Processing Technology, High Temperature Society, pp.13-16
  72. Tomokazu Sano, Osami Sakata, Akio Hirose and Kojiro F. Kobayashi: “Femtosecond Laser Quenching of the High-Pressure Phase in the Single Crystal Iron”, Smart Processing Technology, Vol.1 (2006), Proceedings of International Symposium on Smart Processing Technology, High Temperature Society, pp.17-20

  73. Takuto Yamaguchi, Eiichi Ide, Shinji Kobayashi, Akio Hirose, Kojiro F. Kobayashi, Masanori Yamagiwa and Yoshinori Murakami: “Novel Electronics Assembly Process using Ag Nanoparticles - Development of Bonding Process for Aluminum -“, Smart Processing Technology, Vol.1 (2006), Proceedings of International Symposium on Smart Processing Technology, High Temperature Society, pp.187-190

  74. Hideki Ozaki, Takashi Yamamoto, Akio Hirose, Kojiro F. Kobayashi, Masaaki Ishio, Kazuhiro Shiomi and Akio Hashimoto: “Formation of Micro Joints with High Melting Temperature by Rapid Reaction between Sn-Ag Solder and Ni-Fe Substrate”, Smart Processing Technology, Vol.1 (2006), Proceedings of International Symposium on Smart Processing Technology, High Temperature Society, pp.191-194

  75. Takuto Yamaguchi, Eiichi Ide, Akio Hirose and Kojiro F. Kobayashi: “Sintering Mechanism of Composite Nanoparticle and its Application to Bonding in Electronics”, Proceedings of Materials Science and Technology 2006: Materials and Systems Vol.2 (2006), pp.271-282

  76. Hideki Ozaki, Takashi Yamamoto,, Akio Hirose, Kojiro F. Kobayashi, Masaaki Ishio, Kazuhiro Shiomi and Akio Hashimoto: “Formation of Micro Joints with High-melting Point through Rapid Reaction between Sn-3.5Ag Solder and Ni-Fe Alloy Substrate”, Proceedings of  Materials Science and Technology 2006: Product Manufacturing (2006), pp.147-156

  77. Miki Kondo, Yusuke Akada, Akio Hirose and Kojiro F. Kobayashi: “Properties of Bi-In-Sn Ternary Alloys for Low-melting Point Solders”, Proceedings of  Materials Science and Technology 2006: Product Manufacturing (2006), pp.201-213

  78. Kengo Takahashi, Tomokazu Sano, Akio Hirose and Kojiro F. Kobayashi “Influence of the Grain Boundary on the Femtosecond Laser Ablation of Metals”: Proceedings of Materials Science and Technology 2006, (2006), pp.365-372

大学紀要

  1. Yoneo Kikuta, Takao Araki and Akio Hirose, "Effect of Nonmetallic Inclusions on HAZ Hydrogen Assisted Cracking": Technology Reports of the Osaka University, 36(1986), pp. 55-63.
  2. Yoneo Kikuta, Takao Araki, Akio Hirose and Jiang Ying Xiu, "Susceptibility of Continuously Cast TMCP Steels to Weld Cold Cracking": Technology Reports of the Osaka University, 37(1987), pp.65-74.

解説

  1. 廣瀬明夫、荒木孝雄,「TiNi系形状記憶合金の溶接」: 金属, 59(1989), pp. 61-68
  2. 廣瀬明夫、小林紘二郎,「エレクトロニクスにおけるマイクロ接合の現状と将来」: まてりあ, 33(1994), pp.1382-1389
  3. 廣瀬明夫,「日本における溶接の展望（1993-1～12）金属基複合材料」: 溶接学会誌, 63(1994), pp.340-342.
  4. 廣瀬明夫,「日本における溶接の展望（1994-1～12）金属基複合材料」: 溶接学会誌, 64(1995), pp.342-344.
  5. 廣瀬明夫,「連載講義：セラミックス・複合材の接合　複合材料の接合（その２）-金属基複合材料の接合-」: 溶接学会誌 , 65(1996), pp.526-530.
  6. 廣瀬明夫、小林紘二郎,「先端チタン材料の溶接」: 軽金属溶接, (1997), pp.535-542.
  7. 廣瀬明夫、小林紘二郎,「金属基複合材料及び金属間化合物のレーザ溶接」: 溶接学会誌, 68(1999), pp.526-529.
  8. 廣瀬明夫、小林紘二郎,「自動車へのアルミニウム合金適用の動向とその接合技術の現状」:軽金属溶接, 40(2002), pp.155-161.
  9. 廣瀬明夫、劉六法、小林紘二郎，「レーザ表面溶体化処理によるNi基超合金の水素脆化感受性改善」：レーザ加工学会誌, 9(2002), 217-222.

  10. 黒澤伸隆、廣瀬明夫、小林紘二郎，「窒素添加レーザ溶融焼入れによる自動車用鋼板の高強度化」：レーザ加工学会誌, 9(2002), 231-235.

  11. 廣瀬明夫，井出英一，小林紘二郎：「ナノ粒子を用いた新しい接合技術」，エレクトロニクス実装学会誌, 7(2004), No.6, pp.511-515

  12. 廣瀬明夫，小林紘二郎：「Sn-Ag系鉛フリーはんだ実装における微細界面構造と継手信頼性」，金属，74(2004)，No.12，pp.1253-1257

  13. 塚本進，廣瀬明夫，結城正弘：「溶接・接合工学の最近の動向　I溶接の材料科学　４．新材料の溶接・接合」，溶接学会誌，74(2005)，No.5，pp.288-289

  14. 廣瀬明夫、小林紘二郎：「自動車用溶接・接合技術」, 軽金属, 56(2006), pp.184-188
  15. 廣瀬明夫：「高温対応鉛フリー実装」，高温学会誌，32(2006)，pp.200-207
  16. 廣瀬明夫，山口拓人，井出英一，小林紘二郎：「複合型銀ナノ粒子を用いた接合技術」，エレクトロニクス実装学会誌, 9（2006），No.7，pp.528-532

  17. 廣瀬明夫，小林紘二郎：「複合型ナノ粒子を用いた新しい接合プロセス」, 化学工業, 57(2006), No.11, pp.827-833

著　書

  1. 分担執筆、「接合・溶接技術Ｑ＆Ａ1000」:（株）産業技術サービスセンター, (1999)
  2. 分担執筆、「溶接部の材料挙動のモデリングとシミュレーション：溶接学会技術資料ブリテンNo.14」:溶接学会, (1999)
  3. 分担執筆、「生産科学」：共立出版（株）, (2000)
  4. 分担執筆、「溶接・接合便覧」：丸善㈱，(2003)
  5. 分担執筆、「溶接冶金研究の進歩と今後の展望：溶接学会技術資料ブリテンNo.15」：溶接学会，（2003）

  6. 分担執筆、「導電性ナノフィラーと応用製品」：シーエムシー出版（監修：小林征男），(2005)

  7. 分担執筆、“Novel Materials Processing by Advanced Electromagnetic Energy Sources”, ELSEVIER (Edited by S. Miyake), (2005)

  8. 分担執筆、「金属粒子ペーストのインクジェット微細配線」：シーエムシー出版（監修：菅沼克昭），(2006)

特許


　　　出願：１６件

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