査読付き国際会議発表論文


2013/ 2012/ 2011/ 2010/ 2009/ 2008/ 2007/ 2006/ 2005/ 2004
 
2012
  1. T. Ogura, T. Nishida, H. Nishida, S. Yoshikawa, T. Yoshida, N. Omichi, M. Fujimoto, A. Hirose,Microstructure and Mechanical Properties of Friction Stir Welded Aluminum Alloy/Stainless Steel Lap Joints, Proc.13th Inter. Conf. on Aluminum Alloys (ICAA13), TMS, pp.1051-1056 (2012).
  2. T. Sato and T. Ogura, Nanocluster Formation Behavior in Al-Zn-Mg Alloys with Microalloying Elements and Improved Mechanical Properties, Proc.13th Inter. Conf. on Aluminum Alloys (ICAA13), TMS, pp.647-652 (2012).
 
2011
  1. T. Yagishita, T. Ogura and A. Hirose, Bondability of Low Tenperature Sinter Bonding Process Using Ag2O Pastes with Polyethlene Glycols, Proc. International Conference on Electronics Packaging 2011 (ICEP2011), JIEP et al., pp.247-252 (2011).
 
2010
  1. T. Ogura, Y. Saito K. Ueda and A. Hirose, Nano-scale Evaluation of Interfacial Reaction Layers in Aluminum and Steel Dissimilar Metals Joints with Alloying Elements using Nanoindentation Technique, Proc.12th Inter. Conf. on Aluminum Alloys (ICAA12), The Japan Institute of Light Metals (JILM), pp.956-960 (2010).
  2. T. Ogura, S. Hirosawa, A. Hirose and T. Sato, Effects of Microalloying Sn and (Ag+Sn) on Precipitation in the Vicinity of Grain Boundaries in Al-Zn-Mg Alloys, Proc.12th Inter. Conf. on Aluminum Alloys (ICAA12), The Japan Institute of Light Metals (JILM), pp.1922-1926 (2010).
  3. K. Ueda, T. Ogura, S. Nishiuchi, K. Miyamoto, T. Nanbu and A. Hirose, The Effect of Zn-based Alloys Coating on Bondability of Resistance Spot Welding of Steel/Aluminum Alloy Dissimilar Joint, Proc.12th Inter. Conf. on Aluminum Alloys (ICAA12), The Japan Institute of Light Metals (JILM), pp.1774-1779 (2010).
  4. T. Nishida, T. Ogura, M. Fujimoto and A. Hirose, Microstructure and Mechanical Properties of 5000 System Al Stud Joints with Zn Insert Using Friction Welding, Proc.12th Inter. Conf. on Aluminum Alloys (ICAA12), The Japan Institute of Light Metals (JILM), pp.972-977 (2010).
  5. A. Hirose, H. Umeshita, Y. Saito and T. Ogura, Effects of Alloying Si and Cu to Al Alloys on Interfacial Reaction and Joint Strength in Dissimilar Metals Joints of Al Alloys to Steel, Proc. 11th International Aluminium Conference - ‘INALCO’ New Frontiers in Light Metals, Delft University of Technology et al., pp.956-960 (2010).
 
2009
  1. N. Takeda, H. Tatsumi, Y. Akada, T. Ogura, E. Ide, T. Morita and A. Hirose, A Novel Metal-to-metal Bonding Process Utilizing Low-temperature Sinterability of Ag2O-derived Ag Nanoparticles, Proc. International Conference on Electronics Packaging 2009 (ICEP2009), JIEP et al., pp.760-765 (2009).
 
2008
  1. T. Mashimo, Y. Iguchi, R. Bagum, T. Sano, O. Sakata, M. Ono, and S. Okayasu, Formation of multi-layer structures in Bi3Pb7 intermetallic compounds under an ultra-high gravitational field, AIP Conf. Proc. 973, pp.502-505 (2008). [DOI, 10.4028/www.scientific.net/DDF.289-292.357]
  2. Hidetaka Umeshita, Hiroaki Imaeda, Akio Hirose and Kojiro F. Kobayashi, Effects of Alloying Elements on Interfacial Properties of Dissimilar Joint of Aluminum Alloy and Steels, Proceedings of The Second International Symposium on Smart Processing Technology, Vol. 2, pp.199-202 (2008).
  3. Yusuke Akada, Hiroaki Tatsumi, Takuto Yamaguchi, Akio Hirose, Toshiaki Morita and Eiichi Ide, Investigation of Bonding Mechanism of Ag Nanoparticles to Bulk Metals, Proceedings of The Second International Symposium on Smart Processing Technology，Vol. 2, pp.187-190 (2008).
 
2007
  1. Y. Sano and T. Sano, Precursor decay in single crystal lithium fluoride, in Shock Compression of Condensed Matter - 2007, edited by M. Elert, M. D. Furnish, R. Chau, N. C. Holmes, and J. Nguyen (AIP Conference Proceedings 955, New York, 2007), pp. 263-266 (2007). [doi, http,//dx.doi.org/10.1063/1.2833026]
  2. Y. Sano and T. Sano, Unsteady state Rankine-Hugoniot jump conditions, in Shock Compression of Condensed Matter - 2007, edited by M. Elert, M. D. Furnish, R. Chau, N. C. Holmes, and J. Nguyen (AIP Conference Proceedings 955, New York, pp.267-270 (2007). [doi, http,//dx.doi.org/10.1063/1.2833027]
  3. Y. Sano and T. Sano, Jump across an outgoing spherical shock wave front, in Shock Compression of Condensed Matter - 2007, edited by M. Elert, M. D. Furnish, R. Chau, N. C. Holmes, and J. Nguyen (AIP Conference Proceedings 955, New York, 2007), pp. 271-274 (2007). [doi, http,//dx.doi.org/10.1063/1.2833028]
  4. Y. Sano and T. Sano, Evaluation of the precursor decay anomaly in single crystal lithium fluoride, in Shock Compression of Condensed Matter - 2007, edited by M. Elert, M. D. Furnish, R. Chau, N. C. Holmes, and J. Nguyen (AIP Conference Proceedings955,NewYork,2007), pp.275-278 (2007). [doi,http,//dx.doi.org/10.1063/1.2833029]
  5. Y. Sano and T. Sano, Dynamic yielding behind near-steady precursors, in Shock Compression of Condensed Matter - 2007, edited by M. Elert, M. D. Furnish, R. Chau, N. C. Holmes, and J. Nguyen (AIP Conference Proceedings 955, New York, 2007), pp.279-282 (2007). [doi, http,//dx.doi.org/10.1063/1.2833030]
 
2006
  1. Miki Kondo, Yusuke Akada, Akio Hirose and Kojiro F. Kobayashi, Properties of Bi-In-Sn Ternary Alloys for Low-melting Point Solders, Proceedings of Materials Science and Technology 2006, Product Manufacturing，pp.201-213 (2006).
  2. Hideki Ozaki, Takashi Yamamoto, Akio Hirose, Kojiro F. Kobayashi, Masaaki Ishio, Kazuhiro Shiomi and Akio Hashimoto, Formation of Micro Joints with High-melting Point through Rapid Reaction between Sn-3.5Ag Solder and Ni-Fe Alloy Substrate, Proceedings of Materials Science and Technology 2006, Product Manufacturing，pp.147-156 (2006).
  3. Takuto Yamaguchi, Eiichi Ide, Akio Hirose and Kojiro F. Kobayashi, Sintering Mechanism of Composite Nanoparticle and its Application to Bonding in Electronics，Proceedings of Materials Science and Technology 2006, Materials and Systems，Vol.2, pp.271-282 (2006).
  4. T. Sano, A. Hirose, K. F. Kobayashi, and O. Sakata, Femtosecond laser quenching of the high-pressure phase of iron in the single crystal," Proc. Smart Processing Technology, pp.17-20 (2006).
  5. Hideki Ozaki, Takashi Yamamoto, Akio Hirose, Kojiro F. Kobayashi, Masaaki Ishio, Kazuhiro Shiomi and Akio Hashimoto, Formation of Micro Joints with High Melting Temperature by Rapid Reaction between Sn-Ag Solder and Ni-Fe Substrate，Proceedings of International Symposium on Smart Processing Technology，Vol.1, pp.191-194 (2006) .
  6. Takuto Yamaguchi, Eiichi Ide, Shinji Kobayashi, Akio Hirose, Kojiro F. Kobayashi, Masanori Yamagiwa and Yoshinori Murakami, Novel Electronics Assembly Process using Ag Nanoparticles - Development of Bonding Process for Aluminum -，Proceedings of International Symposium on Smart Processing Technology，Vol.1, pp.187-190 (2006).
  7. Miki Kondo, Hiroaki Imaeda, Akio Hirose and Kojiro F. Kobayashi, Effects of Si and Mg on Bondability of Dissimilar Joining of Al alloys to Steel for Light Weight Car Body, Proceedings of International Symposium on Smart Processing Technology，Vol.1, pp.13-16 (2006).
  8. Y. Sano and T. Sano, Thermal properties of close-packed Fe up to 400 GPa determined using Hugoniot functions, in Shock Compression of Condensed Matter - 2005, edited by M. D. Furnish, M. Elert, T. P. Russell, C. T. White (AIP Conference Proceedings 845, New York, 2006), pp.135-138 (2006). [doi, http,//dx.doi.org/10.1063/1.2263283]
  9. Akio Hirose, Eiichi Ide, Shinji Angata, Shinji Kobayashi and Kojiro F. Kobayashi, Characteristics of Bonding Process Using Ag Mettalo-Organic Nanoparticles，Proceedings of International Conference on Electronics Packaging，pp.59-64 (2006).
 
2005
  1. Yosuke Sogo, Takashi Hojo, Hiroaki Iwanishi, Akio Hirose, Kojiro F. Kobayashi,　Atsushi Yamaguchi, Akio Furusawa and Kazutoshi Nishida, Interfacial Reaction Between Sn8Zn3Bi and NiAu Plating，Proc. Material Solution Conference and Exposition, Columbus, in press pp.67-74 (2005).
  2. T. Katayama, F. Matsui, N. Yoshida, A. Hirose, K. F. Kobayashi, K. Shibata, H. Sakamoto, H. Sakurai and K. Kanamori, Properties of Weld Joints of Bake-Hardening Steel for Automobile，Proc. Material Solution Conference and Exposition, Columbus, in press pp.195-200 (2005).
  3. Eiichi Ide, Shinji Angata, Akio Hirose, and Kojiro F. Kobayashi, Novel Bonding Process Using Ag Nanoparticles -Influence of Bonding Conditions-, Proc. Material Solution Conference and Exposition, Columbus, in press pp.174-182 (2005).
  4. Akio Hirose, Keizoh Honda and Kojiro F. Kobayashi, Formation of Nitride Reinforved TiAl Layers by Reactive Low Pressure Plasama Spraying with Nitrogen Gas， Proceedings of International Symposium on Novel Materials Processing by Advanced Electromagnetic Energy Sourves (MAPEES '04), pp.411-414 (2005).
  5. Hiroki Imaeda, Miki Kondo, Akio Hirose and Kojiro F. Kobayashi, Effect of Interfacial Microstructure on Strength of Dissimilar Joint of Aluminum Alloys and Steels for Light-Weight Auto Body, Proceedings of Materials Science & Technology, Joining of Monolithic Structures and Components，pp.17-27 (2005).
  6. Akio Hirose, Takashi Hojo, Yosuke Sogo, Ryoko Miwa, Kojiro F. Kobayashi, Atsushi Yamaguchi, Akio Furusawa and Kazuto Nishida, Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Soldr, Proc. ASME InterPACK 2005, IPACK2005-73167，IPACK2005-73167 (2005).
  7. Shinji Angata, Eiichi Ide, Shinji Kobayashi, Akio Hirose and Kojiro F. Kobayashi, The Sintering Process of Ag Metallo-Organic Nanoparticles and The Influence of The Joining Parameters upon Cu-to-Cu Joining, Proc. ASME InterPACK 2005, IPACK2005-73164，IPACK2005-73164 (2005).
  8. Shinji Kobayashi, Eiichi Ide, Shinji Angata, Akio Hirose and Kojiro F. Kobayashi, The Bondabilities of Various Metals Using Ag Metallo-Organic Nanoperticles and These Bonding Nechanism，Proc. ASME InterPACK 2005, IPACK2005-73161，IPACK2005-73161 (2005).
 
2004
  1. Akio Hirose, Hiroto Yanagawa, Eiichi Ide, Kojiro F. Kobayashi, Effect of Interfacial Microstructure on Joint Strength between Sn-Ag-Cu and Sn-Zn-Bi Solders and Cu Substrate, Proceedings of Electronics Goes Green pp.363-368 (2004).
  2. T. Sano, H. Mori, O. Sakata, E. Ohmura, I. Miyamoto, A. Hirose, and K. F. Kobayashi, Femtosecond laser driven shock quenching of the high-pressure phase of iron, Proc. SPIE 5662, pp.678-683 (2004).
  3. T. Sano, M. Yanai, E. Ohmura, Y. Nomura, I. Miyamoto, A. Hirose, and K. F. Kobayashi, Fabrication of microspike-arrays on tungsten surface using femtosecond laser, Prof. SPIE 5662, pp.760-765 (2004).
  4. Atsushi Yamaguchi, Yuhei Yamashita, Akio Furusawa, Kazuto Nishida, Takashi Hojo, Yosuke Sogo, Ayako Miwa, Akio Hirose and Kojiro F. Kobayashi, Reliability of CSP Solder Joints with Lower Melting Lead-free Solder, Proceedings of 37th Interernational Symposium on Microelectronics, TP4, pp.8-17 (2004).