HIROSE lab._Event

What's new


2016-7-30
(latest news is below)
■Celebration party for Prof. Hirose's 60th birthday.

↑click(9MB)

→Pictures of party.
2020-8
■Paper accepted.
"Lowering Bonding Temperature for Silver Sintering to Silicon and Silicon Carbide using Silver Oxide Decomposition"
Kota Inami, Tomoki Matsuda, Rei Kawabata, Tomokazu Sano, Akio Hirose
Journal of Materials Science: Materials in Electronics
2020-7
■We attended IIW online meeting.
2020-5
■Paper accepted.
"Microstructure and Mechanical Properties of Additively Manufactured CoCrW Alloy using Laser Metal Deposition"
Masashi Miyake, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Yasutomo Shiomi, Mitsuo Sasaki
Welding in the World.
2020-5
■Paper published.
"Microscale tensile test of galvannealed steel/aluminum dissimilar joint for estimation of intrinsic interfacial strength"
Tomoki Matsuda, Tomokazu Sano, Masanao Munekane, Mitsuru Ohata, Akio Hirose
Scripta Materialia 186, 196-201 (2020).
2020-5
■Paper published.
"Effect of mismatch in mechanical properties on interfacial strength of aluminum alloy/steel dissimilar joints"
Tomoki Matsuda, Ryoichi Hatano, Tomo Ogura, Reo Suzuki, Hiroto Shoji, Tomokazu Sano, Mitsuru Ohata, Akio Hirose
Materials Science and Engineering: A 786, 139437 (2020).
2020-4
■New M1 students; Ota-san, Tsuchida-kun, Minami-kun, Monma-kun, Yamada-kun, Yoshida-kun, and B4 students; Usui-kun, Kuroiwa-kun, Seo-kun, Hayashi-kun, Miyama-kun.
Welcome to our Lab!!!
2020-4.1
■Sano-sensei was promoted to Professor in Physics of Materials Processing Area →here>
■Ogura-sensei was assigned to Associate Professor in our lab.
2020-3
■Tomoya Asayama, Tomoya Igarashi, Tomohito Uchikawa, Masaki Kasuga, and Masashi Miyake finished their master's degree.
Eri Ota, Shin Monma, Kota Minami, Seigo Yamada, and Masayuki Yoshida finished their bachelor's degree.
Congratulations! Best wishes for your future.
2020-2
■Paper published.
"Study on Improvement of the Initial and Long-Term Reliability in Ultrasonically Bonded Copper Joints"
Yo Tanaka, Sihnnosuke Soda, Takahito Fushimi, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
Journal of the Japan Institute of Electronics Packaging 23, 166 (2020).
2020-1
■Paper published.
"Influence of interfacial structure on the fracture behavior of friction stir spot welded dissimilar joints"
Tomoki Matsuda, Kiriko Owada, Asahi Numata, Hiroto Shoji, Tomokazu Sano, Mitsuru Ohata, Akio Hirose
Materials Science and Engineering: A 772, 1387443 (2019).
2019-9-17~20
■Presentation in 2nd European Workshop on Laser Peening and Related Phenomena held in Germany.
"Dry Laser Peening of Pure Iron using Femtosecond Laser Pulses",
Itsuki Nishibata, Tomoki Matsuda, Tomokazu Sano
Takahisa Shobu(Japan Atomic Energy Agency)
Ayumi Shiro(National Institute for Quantum and Radiological Science and Technology)
2019-9-2
■Presentations in Euromat2019 held in Stockholm, Sweden.
"Influence of interfacial microstructure on the strength of resistance spot welded dissimilar joints between galvannealed steel and aluminum alloy"
Tomoya Asayama, Tomoki Matsuda, Tomokazu Sano, Akio Hirose

"Influence of microstructure on the fracture behavior of friction stir spot welded joint between aluminum alloy and galvanized steel"
Tomohito Uchikawa, Tomoki Matsuda, Tomkazu Sano, Akio Hirose

"Microstructure and Mechanical Properties of Laser-Additive-Manufactured Co-Cr-W Alloy and its gradient material with martensitic stainless steel alloy"
Masashi Miyake, Tomoki Matsuda, Tomokazu Sano, Akio Hirose (Osaka University)
Yasutomo Shiomi, Mitsuo Sasaki, Naotada Okada (Toshiba Corporation)
2019-9
■Paper published.
"Formation Process of the Interface in the Ag/Si Joints by the Decomposition Reaction of Ag2O"
Tomoki Matsuda, Kota Inami, Keita Motoyama, Tomokazu Sano, Akio Hirose
Journal of Smart Processing 8, 177 (2019).
2019-8
■Paper published.
"Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach"
Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Applied Sciences 9, 3476 (2019).
2019-7
■Paper published.
"High-frequency linear friction welding of aluminum alloys to stainless steel"
Tomoki Matsuda, Hironobu Adachi, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Shozo Ono, Akio Hirose
Journal of Materials Processing Technology 269, 45 (2019).
2019-4
■Paper published.
"Thermal fatigue properties of ultrasonic bonded copper joints"
Takahito Fushimi, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
Applied Sciences 9, 1556 (2019).
2019-3-28
■Paper published.
"Thermal fatigue properties of ultrasonic bonded copper joints",
Takahito Fushimi, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
2019-3-7
■Paper published.
"Reliability and temperature resistance of novel solder?metallic mesh composite joints",
Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Journal of Electronic Materials
2019-1-27
■Paper published.
"High-frequency linear friction welding of aluminum alloys to stainless steel",
Tomoki Matsuda, Hironobu Adachi, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Shozo Ono, Akio Hirose
Journal of Materials Processing Technology
2018-12-27
■Paper published.
"Evolution of transient liquid-phase sintered Cu-Sn skeleton microstructure during thermal aging",
Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Applied Sciences
2018-12-2
~5
■Prof. Hirose hosted "4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018)" in Nara. The presentation list is following;
"High-temperature reliability of transient liquid phase sintering joints using copper-solder-resin composite"
Hiroaki Tatsumi1,2, Adrian Lis2, Takeshi Monodane1, Hiroshi Yamagushi1, Yoshihiro Kashiba2, Akio Hirose1 (1Osaka University, 2Mitsubishi Electric Corporation)
"Mechanism of Ag-to-Si bonding using silver oxide paste"
Kota Inami, Tomoki Matsuda, Tomokazu Sano, Akio Hirose (Osaka University)

"The effect of thermal fatigue on ultrasonic-bonded copper joints"
Takahito Fushimi, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Yo Tanaka (Osaka University)

"Size effect of CuO particles during Cu-to-Cu bonding"
Tomoya Igarashi, Tomoki Matsuda, Tomokazu Sano, Akio Hirose (Osaka University)
Lars Dörner, Jolanta Janczak-Rusch, Lars P.H. Jeurgens (Empa)

"SiC direct joining using silver oxide decomposition"
Tomoki Matsuda, Keita Motoyama, Kota Inami, Tomokazu Sano, Akio Hirose (Osaka University)
2018-10-14
~18
■Presentation in MS&T2018 held in Columbus, OH, USA.
"Multiscale Analysis for Clarification of Silver-alumina Bonding Mechanism"
Hajime Ashida, Tomoki Matsuda, Tomokazu Sano, Akio Hirose(Osaka University)

"High-frequency Linear Friction Welding of Aluminum Alloys and Stainless Steel"
Hironobu Adachi, Tomoki Matsuda, Tomkazu Sano, Akio Hirose(Osaka University)
Ryo Yoshida, Hisashi Hori(Nippon Light Metal Company, Ltd.)
Qinglong Pan, Hikotaro Ochiai, Shozo Ono (Mitsui Engineering & Shipbuilding Co., Ltd.)

"Metal-to-Silicon Bonding Using Silver Oxide Reduction Reaction and Its Mechanism"
Kota Inami, Tomoki Matsuda, Tomokazu Sano, Akio Hirose(Osaka University)

"Influence of Microstructure on the Fracture Behavior of Friction Stir Spot Welded Joint between Zinc Coated Steel and 6061 Aluminum Alloy"
Kiriko Owada, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Asahi Numata, Hiroto Shoji, Mitsuru Ohata(Osaka University)

"Microstructures and Mechanical Properties of FSW Joint of 430 MPa and 560 MPa Grade Steel"
Kohei Takeya, Tomoki Matsuda, Tomokazu Sano, Akio Hirose (Osaka University)
Atsushi Takada, Muneo Matsushita, Naoya Hayakawa, Rinsei Ikeda (JFE Steel Corporation)

"Thermal Fatigue Properties of Ultrasonic Bonded Copper Joint"
Takahito Fushimi, Tomoki Matsuda, Tomokazu Sano, Akio Hirose (Osaka University)

"Ultrafast Sstructural Behavior in Shock-compressed Iron Probed Using XFEL"
Tomokazu Sano (Osaka University)

"Silver Oxide Decomposition Assisted Direct Bonding of Silicon Carbide"
Tomoki Matsuda, Keita Motoyama, Tomokazu Sano, Akio Hirose (Osaka University)
2018-10-11
~13
■Presentation in Photonics Asia2018 held in Beijing, China.
"Microstructure and Mechanical Properties of Additively Manufactured Co-Cr-W Alloy
using Laser Metal Deposition Method"
Masashi Miyake, Tomoki Matsuda, Tomokazu Sano, Akio Hirose (Osaka University)
Yasutomo Shiomi, Mitsuo Sasaki, Naotada Okada (Toshiba Corporation)
2018-9-10
■Paper published.
"Bonding through novel solder-metallic mesh composite design",
Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Materials & Design
2018-8-20
■Paper published.
"Relationship between intermetallic compound layer thickness with deviation and interfacial strength for dissimilar joints of aluminum alloy and stainless steel",
Ryoichi Hatano, Tomo Ogura, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
Materials Science & Engineering A
2018-8-14
■Paper published.
"Improvement of corrosion resistance of AA2024-T3 using femtosecond laser peening without protective and confining medium",
Uroš Trdan, Tomokazu Sano, Damjan Klobčar, Yuji Sano, Janez Grum, Roman ŠturmKeita
Corrosion Sciences
2018-7-2
■Paper published.
"AlN-to-metal direct bonding process utilizing sintering of Ag nanoparticles derived from the reduction of Ag2O",
Keita Motoyama, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
Journal of Electric Materials
2018-6-29
■Paper published.
"Silver oxide decomposition mediated direct bonding of silicon-based materials",
Tomoki Matsuda, Kota Inami, Keita Motoyama, Tomokazu Sano, Akio Hirose
Scientific Reports
2018-6-18
■Paper published.
"Femtosecond laser peening of friction stir welded 7075-T73 aluminum alloys",
Terumasa Kawashima, Tomokazu Sano, Akio Hirose, Seiichiro Tsutsumi, Kiyotaka Masaki, Kazuto Arakawa, Hisashi Hori
Journal of Materials Processing Technology
HIROSE lab._Event