Articles


2023/.
 
2023
  1. Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol
    Tomoki Matsuda, Seigo Yamada, Shio Okubo, Akio Hirose
    Journal of Materials Science, accepted.

  2. Ag sinter bonding to Si substrate via temporal formation and decomposition of Ag carboxylate
    Tomoki Matsuda, Rei Kawabata, Takuya Okamoto, Akio Hirose
    Nanomaterials 13, 2292 (2023). (Invited paper)

  3. X-ray free electron laser observation of ultrafast lattice behaviour under femtosecond laser-driven shock compression in iron
    Tomokazu Sano, Tomoki Matsuda, Akio Hirose, Mitsuru Ohata, Tomoyuki Terai, Tomoyuki Kakeshita, Yuichi Inubushi, Takahiro Sato, Kohei Miyanishi, Makina Yabashi, Tadashi Togashi, Kensuke Tono, Osami Sakata, Yoshinori Tange, Kazuto Arakawa, Yusuke Ito, Takuo Okuchi, Tomoko Sato, Toshimori Sekine, Tsutomu Mashimo, Nobuhiko Nakanii, Yusuke Seto, Takahisa Shobu, Yuji Sano, Tomonao Hosokai, Takeshi Matsuoka, Toshinori Yabuuchi, Kazuo A. Tanaka, Hiroyuki Uranishi, Norimasa Ozaki & Ryosuke Kodama
    Scientific Reports, 13, 13796 (2023).

  4. Microstructures at the Interface of Al alloy and galvannealed steel jointed by scrubbing refill friction stir spot welding
    Nagisa Kaiho, Chihiro Iwamoto, Ryusuke Sakon, Tomoki Matsuda, Akio Hirose, Naoki Takeoka
    Welding Letters 41, 5 (2023).

  5. A Study on Convection in Molten Zone of Aluminum Alloy during Fe/Al Resistance Spot Welding
    Muneyoshi Iyota, Tomoki Matsuda, Tomokazu Sano, Masaya Shigeta, Takahisa Shobu, Hirokatsu Yumoto, Takahisa Koyama, Hiroshi Yamazaki, Yasunori Senba, Haruhiko Ohashi, Shunji Goto, Ichiro Inoue, Yujiro Hayashi, Kenji Tamasaku, Taito Osaka, Jumpei Yamada, Makina Yabashi
    Journal of Manufacturing Processes, accepted.

  6. Science-based, data-driven developments in plasma processing for material synthesis and device-integration technologies
    Makoto Kambara, Satoru Kawaguchi, Hae-June Lee, Kazumasa Ikuse, Satoshi Hamaguchi, Takeshi Ohmori, Kenji Ishikawa
    Japanese Journal of Applied Physics 62, SA0803 (2023).

  7. Highly strong interface in Ag/Si sintered joints obtained through Ag2O–Ag composite paste
    Tomoki Matsuda, Ryotaro Seo, Akio Hirose
    Materials Science & Engineering A 865, 144647 (2023).

  8. FSSW多段階負荷プロセスによって接合されたアルミニウム合金板/合金化溶融亜鉛メッキ鋼板の微細組織
    児島伊織, 岩本知広, 清水優歌, 松田朋己, 廣瀬明夫
    溶接学会論文集, 41(1), 90–97 (2023).

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2022
  1. Ag–Cu複合焼結層の耐熱性評価
    松田朋己，山田晴悟，廣瀬明夫
    スマートプロセス学会誌, 11(6), 294–300 (2022).

  2. Influence of pulse duration on mechanical properties and dislocation density of dry laser peened aluminum alloy using ultrashort pulsed laser-driven shock wave
    Masayuki Yoshida, Itsuki Nishibata, Tomoki Matsuda, Yusuke Ito, Naohiko Sugita, Ayumi Shiro, Takahisa Shobu, Kazuto Arakawa, Akio Hirose, Tomokazu Sano
    Journal of Applied Physics, Vol. 132, 075101 (2022).

  3. スクラビング複動式摩擦攪拌点接合継手における異種金属接合界面の局所特性と微細構造の解析
    武岡 正樹, 土田 泰輔, 松田 朋己, 小椋 智, 大橋 良司, 廣瀬 明夫
    溶接学会論文集, Vol. 40, 77-87 (2022).

  4. 摩擦攪拌点接合を用いた新規異材接合法におけるウェルドボンド継手の継手強度特性
    武岡 正樹, 深山 拓真, 松田 朋己, 小椋 智, 大橋 良司, 廣瀬 明夫
    軽金属溶接, Vol. 60, No. 4, pp. 14–21 (2022).

  5. スクラビング複動式摩擦攪拌点接合のアルミニウム合金/超高張力鋼接合への適用
    武岡 正樹, 土田 泰輔, 松田 朋己, 小椋 智, 大橋 良司, 廣瀬 明夫
    軽金属溶接, Vol. 60, No. 2, pp. 21–28 (2022).

  6. Analysis of Mechanical Properties of the Dissimilar Material Joint Using Scrubbing Refill Friction Stir Spot Welding
    Naoki Takeoka, Taisuke Tsuchida, Tomoki Matsuda, Tomo Ogura, Ryoji Ohashi, Akio Hirose
    Journal of Advanced Joining Proecsses, Vol. 5, 100112 (2022).

  7. Fracture dominant in friction stir spot welded joint between 6061 aluminum alloy and galvannealed steel based on microscale tensile testing
    Tomoki Matsuda, Toshiya Ogaki, Kotaro Hayashi, Chihiro Iwamoto, Takashi Nozawa, Mitsuru Ohata, Akio Hirose
    Materials & Design, Vol. 213, 110344 (2022).

  8. Reduction behavior of surface oxide on submicron copper particles for pressureless sintering under reducing atmosphere
    Tomoki Matsuda, Daiki Yamagiwa, Hideki Furusawa, Kenji Sato, Hisashi Yashiro, Keigo Nagao, Jungeun Kim, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
    Journal of Electronic Materials, Vol. 51, 1-7 (2022).

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