Articles


2026/2025/2024/2023/2022/2021/2020/2019/2018
2026
  1. Comparative multiscale evaluation of the temperature-dependent interfacial strength in aluminum alloy/carbon fiber-reinforced thermoplastic joints
    Tomoki Matsuda, Ren Sato, Kazuma Shimizu, Akihisa Takeuchi, Kentaro Uesugi, Masahiro Yasutake, Tomokazu Sano, Akio Hirose
    Composites Part: B, accepted.

  2. Plastic flow during dissimilar friction stir spot welding of Al alloy to carbon-fiber-reinforced polyamide-6 thermoplastic
    Tomoki Matsuda, Ren Sato, Ryota Fukui, Fumikazu Miyasaka, Akio Hirose, , Quarterly Journal of the Japan Welding Society, 44(1), 26-34 (2026).
    https://doi.org/10.2207/qjjws.44.26

  3. Enhancing mechanical reliability of silver sinter joints through deformability-contrasted graded structures
    Tomoki Matsuda, Takuya Okamoto, Takugo Naganuma, Shinji Fukumoto, Makoto Kambara, Materials & Design, 264, 115742 (2026)
    https://doi.org/10.1016/j.matdes.2026.115742

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2025
  1. Carboxylic immersion assisted-sinter bonding using preformed silver layer
    Tomoki Matsuda, Takuya Okamoto, Akio Hirose Materials Letters, 405 (2026) 139756.
    https://doi.org/10.1016/j.matlet.2025.139756

  2. Enhancing post-bonding oxidation resistance of low-pressure Cu sintered joints via residual reductant retention
    Tomoki Matsuda, Shio Okubo, Makoto Kambara, Akio Hirose
    Journal of Materials Science, 60, 19236-19248 (2025).
    https://doi.org/10.1007/s10853-025-11525-x

  3. Current-assisted low-temperature silver sinter bonding to silicon carbide by utilizing ion migration
    Tetsuhiro Matsuda, Tomoki Matsuda, Makoto Kambara, Akio Hirose
    Materials & Design, 252, 113780 (2025).
    https://doi.org/10.1016/j.matdes.2025.113780

  4. Direct measurement of lattice behavior during femtosecond laser-driven shock front formation in copper
    Naoya Egashira, Tomoki Matsuda, Takuo Okuchi, Yusuke Seto, Yusuke Ito, Takahisa Shobu, Nobuhiko Nakanii, Yuichi Inubushi, Tadashi Togashi, Kohei Miyanishi, Tsutomu Mashimo, Tomokazu Sano
    Journal of Applied Physics, 137, 105903 (2025).
    https://doi.org/10.1063/5.0253150

  5. Lowering temperature of Cu sinter bonding under low-pressure in ambient air by in-situ generation and reduction of Cu2O nanoparticles
    Miwa Oba, Tomoki Matsuda, Masashi Dougakiuchi, Shio Okubo, Makoto Kambara
    Journal of Materials Science: Materials in Electronics, 36(4), 291 (2025).
    https://doi.org/10.1007/s10854-025-14352-7

  6. Evaluation of thermal anisotropic evolution in the sinter structure of direct sinter joining to silicon via coupled microstructural characterizations
    Tomoki Matsuda, Ryotaro Seo, Akihisa Takeuchi, Kentaro Uesugi, Masahiro Yasutake, Makoto Kambara, Akio Hirose
    Materials Science & Engineering A, 923, 147692 (2025).
    https://doi.org/10.1016/j.msea.2024.147692

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2024
  1. Convection and Joint Characteristics in Aluminum Alloy Melting Zone during Resistance Spot Welding of Dissimilar Fe-Al Material in External Magnetic Field
    Yuta Funabiki, Muneyoshi Iyota, Takahisa Shobu, Tomoki Matsuda, Hirokatsu Yumoto, Takahisa Koyama, Hiroshi Yamazaki, Yasunori Senba, Haruhiko Ohashi, Ichiro Inoue, Gota Yamaguchi, Yujiro Hayashi, Makina Yabashi, Tomokazu Sano Journal of Manufacturing Processes, 115 40-55 (2024).
    https://doi.org/10.1016/j.jmapro.2024.01.049
  2. Transient liquid-phase infiltration bonding of copper using porous copper interlayer
    Ryo Miyajima, Ryota Yagane, Michiya Matsushima, Shinji Fukumoto
    Journal of Materials Science: Materials in Electronics 35(5), 344 (2024).

  3. Conductivity Improvement of Electrically Conductive Adhesive Using Tin-Coa ted Copper with Sn-3.0Ag-0.5Cu Bridging
    Michiya MATSUSHIMA, Kotaro TANIYAMA, Takumi SENDA, Shinji FUKUMOTO
    Journal of Smart Processing 13(5),246-252 (2024).

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2023
  1. Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol
    Tomoki Matsuda, Seigo Yamada, Shio Okubo, Akio Hirose
    Journal of Materials Science, accepted.

  2. Ag sinter bonding to Si substrate via temporal formation and decomposition of Ag carboxylate
    Tomoki Matsuda, Rei Kawabata, Takuya Okamoto, Akio Hirose
    Nanomaterials 13, 2292 (2023). (Invited paper)

  3. X-ray free electron laser observation of ultrafast lattice behaviour under femtosecond laser-driven shock compression in iron
    Tomokazu Sano, Tomoki Matsuda, Akio Hirose, Mitsuru Ohata, Tomoyuki Terai, Tomoyuki Kakeshita, Yuichi Inubushi, Takahiro Sato, Kohei Miyanishi, Makina Yabashi, Tadashi Togashi, Kensuke Tono, Osami Sakata, Yoshinori Tange, Kazuto Arakawa, Yusuke Ito, Takuo Okuchi, Tomoko Sato, Toshimori Sekine, Tsutomu Mashimo, Nobuhiko Nakanii, Yusuke Seto, Takahisa Shobu, Yuji Sano, Tomonao Hosokai, Takeshi Matsuoka, Toshinori Yabuuchi, Kazuo A. Tanaka, Hiroyuki Uranishi, Norimasa Ozaki & Ryosuke Kodama
    Scientific Reports, 13, 13796 (2023).

  4. Microstructures at the Interface of Al alloy and galvannealed steel jointed by scrubbing refill friction stir spot welding
    Nagisa Kaiho, Chihiro Iwamoto, Ryusuke Sakon, Tomoki Matsuda, Akio Hirose, Naoki Takeoka
    Welding Letters 41, 5 (2023).

  5. A Study on Convection in Molten Zone of Aluminum Alloy during Fe/Al Resistance Spot Welding
    Muneyoshi Iyota, Tomoki Matsuda, Tomokazu Sano, Masaya Shigeta, Takahisa Shobu, Hirokatsu Yumoto, Takahisa Koyama, Hiroshi Yamazaki, Yasunori Senba, Haruhiko Ohashi, Shunji Goto, Ichiro Inoue, Yujiro Hayashi, Kenji Tamasaku, Taito Osaka, Jumpei Yamada, Makina Yabashi
    Journal of Manufacturing Processes, accepted.

  6. Science-based, data-driven developments in plasma processing for material synthesis and device-integration technologies
    Makoto Kambara, Satoru Kawaguchi, Hae-June Lee, Kazumasa Ikuse, Satoshi Hamaguchi, Takeshi Ohmori, Kenji Ishikawa
    Japanese Journal of Applied Physics 62, SA0803 (2023).

  7. Highly strong interface in Ag/Si sintered joints obtained through Ag2O?Ag composite paste
    Tomoki Matsuda, Ryotaro Seo, Akio Hirose
    Materials Science & Engineering A 865, 144647 (2023).

  8. FSSW多段階負荷プロセスによって接合されたアルミニウム合金板/合金化溶融亜鉛メッキ鋼板の微細組織
    児島伊織, 岩本知広, 清水優歌, 松田朋己, 廣瀬明夫
    溶接学会論文集, 41(1), 90?97 (2023).
  9. Electrodeposition Bonding of Copper to Aluminum via Anodic Oxide Film
    Yuto TANAKA, Ryosuke TSUTSUI, Michiya MATSUSHIMA, Shinji FUKUMOTO
    QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY Vol. 41(4) pp.356-363 (2023)

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2022
  1. Ag?Cu複合焼結層の耐熱性評価
    松田朋己，山田晴悟，廣瀬明夫
    スマートプロセス学会誌, 11(6), 294?300 (2022).

  2. Influence of pulse duration on mechanical properties and dislocation density of dry laser peened aluminum alloy using ultrashort pulsed laser-driven shock wave
    Masayuki Yoshida, Itsuki Nishibata, Tomoki Matsuda, Yusuke Ito, Naohiko Sugita, Ayumi Shiro, Takahisa Shobu, Kazuto Arakawa, Akio Hirose, Tomokazu Sano
    Journal of Applied Physics, Vol. 132, 075101 (2022).

  3. スクラビング複動式摩擦攪拌点接合継手における異種金属接合界面の局所特性と微細構造の解析
    武岡 正樹, 土田 泰輔, 松田 朋己, 小椋 智, 大橋 良司, 廣瀬 明夫
    溶接学会論文集, Vol. 40, 77-87 (2022).

  4. 摩擦攪拌点接合を用いた新規異材接合法におけるウェルドボンド継手の継手強度特性
    武岡 正樹, 深山 拓真, 松田 朋己, 小椋 智, 大橋 良司, 廣瀬 明夫
    軽金属溶接, Vol. 60, No. 4, pp. 14?21 (2022).

  5. スクラビング複動式摩擦攪拌点接合のアルミニウム合金/超高張力鋼接合への適用
    武岡 正樹, 土田 泰輔, 松田 朋己, 小椋 智, 大橋 良司, 廣瀬 明夫
    軽金属溶接, Vol. 60, No. 2, pp. 21?28 (2022).

  6. Analysis of Mechanical Properties of the Dissimilar Material Joint Using Scrubbing Refill Friction Stir Spot Welding
    Naoki Takeoka, Taisuke Tsuchida, Tomoki Matsuda, Tomo Ogura, Ryoji Ohashi, Akio Hirose
    Journal of Advanced Joining Proecsses, Vol. 5, 100112 (2022).

  7. Fracture dominant in friction stir spot welded joint between 6061 aluminum alloy and galvannealed steel based on microscale tensile testing
    Tomoki Matsuda, Toshiya Ogaki, Kotaro Hayashi, Chihiro Iwamoto, Takashi Nozawa, Mitsuru Ohata, Akio Hirose
    Materials & Design, Vol. 213, 110344 (2022).

  8. Reduction behavior of surface oxide on submicron copper particles for pressureless sintering under reducing atmosphere
    Tomoki Matsuda, Daiki Yamagiwa, Hideki Furusawa, Kenji Sato, Hisashi Yashiro, Keigo Nagao, Jungeun Kim, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
    Journal of Electronic Materials, Vol. 51, 1-7 (2022).
  9. Change in electrical conductivity of electrically conductive adhesives during curing process
    Shinji Fukumoto, Kazuhiro Makimoto, Kengo Ohta, Tomohiro Nakamura, Michiya Matsushima, Kozo Fujimoto
    Journal of Materials Science Vol. 57(24), 11189-11201 (2022)

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2021
  1. Friction stir spot welding of aluminum and carbon fiber reinforced thermoplastic using hybrid surface treatment improving interfacial properties
    Eri Ota, Tomoki Matsuda, Hiroto Shoji, Tomo Ogura, Fumikazu Miyasaka, Tomokazu Sano, Mitsuru Ohata, Akio Hirose
    Materials & Design, Vol. 212, 110221 (2021).

  2. 複動式摩擦攪拌点接合を用いたアルミニウム合金/亜鉛めっき鋼の新規接合法の開発
    武岡 正樹、深山 拓真、松田 朋己、小椋 智、大橋 良司、廣瀬 明夫
    溶接学会論文集、採択済

  3. Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface oxidized submicron Cu particles
    Daiki Yamagiwa, Tomoki Matsuda, Hideki Furusawa, Kenji Sato, Hiroaki Tatsumi, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
    Journal of Materials Science: Materials in Electronics, Vol.32, 19031-19041 (2021)

  4. Fracture behavior of thermally aged Ag-Cu composite sinter joint through microscale tensile test coupled with nano X-ray computed tomography
    Tomoki Matsuda, Seigo Yamada, Akihisa Takeuchi, Kentaro Uesugi, Masahiro Yasutake, Tomokazu Sano, Mitsuru Ohata, Akio Hirose
    Materials & Design, Vol. 206, 109818 (2021)

  5. Metallization-free silver sinter bonding to silicon via in situ decomposition of silver oxalate
    Rei Kawabata, Tomoki Matsuda, Ryotaro Seo, Akio Hirose.
    Materials Letters, Vol. 300, 130205 (2021).

  6. Formation of interfacial reaction layer for stainless steel/aluminum alloy dissimilar joint in linear friction welding
    Tomoki Matsuda, Hironobu Adachi, Ryo Yoshida, Tomokazu Sano, Hisashi Hori, Akio Hirose
    Materials Today Communications, Vol. 26, 101700 (2021).
  7. Effect of stress gradient on heat cycle fatigue life prediction of solder joints by repetitive bending test
    Michiya Matsushima, Kei Endo, Tetsuya Kawazoe, Shinji Fukumoto, Kozo Fujimoto
    Materials Science Forum, Vol. 1016 MSF, 875-881(2021).

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2020
  1. Thermal stability and characteristic properties of pressureless sintered Ag layers formed with Ag nanoparticles for power device applications
    Tomofumi Watanabe, Masafumi Takesue, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
    Journal of Materials Science: Materials in Electronics, Vol. 31, 17173-17182(2020).

  2. Lowering bonding temperature for silver sintering to silicon and silicon carbide using silver oxide decomposition
    Kota Inami, Tomoki Matsuda, Rei Kawabata, Tomokazu Sano, Akio Hirose
    Journal of Materials Science: Materials in Electronics, Vol. 31, 16511-16518(2020).

  3. Microscale tensile test of galvannealed steel/aluminum dissimilar joint for estimation of intrinsic interfacial strength
    Tomoki Matsuda, Tomokazu Sano, Masanao Munekane, Mitsuru Ohata, Akio Hirose
    Scripta Materialia, Vol.186, 196-201 (2020).

  4. Effect of mismatch in mechanical properties on interfacial strength of aluminum alloy/steel dissimilar joints
    Tomoki Matsuda, Ryoichi Hatano, Tomo Ogura, Reo Suzuki, Hiroto Shoji, Tomokazu Sano, Mitsuru Ohata, Akio Hirose
    Materials Science and Engineering A, Vol.786, 139437 (2020).

  5. Microstructure and Mechanical Properties of Additively Manufactured CoCrW Alloy using Laser Metal Deposition
    Masashi Miyake, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Yasutomo Shiomi, Mitsuo Sasaki
    Welding in the World, accepted.

  6. Study on Improvement of the Initial and Long-Term Reliability in Ultrasonically Bonded Copper Joints
    Yo Tanaka, Sihnnosuke Soda, Takahito Fushimi, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
    Journal of the Japan Institute of Electronics Packaging, Vol.23(2), 166-172.

  7. Influence of interfacial structure on the fracture behavior of friction stir spot welded dissimilar joints
    Tomoki Matsuda, Kiriko Owada, Asahi Numata, Hiroto Shoji, Tomokazu Sano, Mitsuru Ohata, Akio Hirose
    Materials Science and Engineering A, Vol.772, 138743 (2020).

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 2019
  1. 低弾性率中間層を導入した硬質樹脂封止型パワーモジュール内部の応力-ひずみ評価
    多谷本 真聡, 福本 信次, 松嶋 道也, 藤本 公三
    スマートプロセス学会誌, 8(5), pp.205-212 (2019).

  2. Characteristics and microstructural development of cold-sprayed copper coating on aluminum
    Shinji Fukumoto, Kengo Ohta, Tatsunori Yanagimoto, Yoshihiro Kashiba, Masao Kikuchi, Michiya Matsushima, Kozo Fujimoto
    Materials Transactions,60(2), pp.602-610 (2019).

  3. Development of polyester-modified epoxy resins for self-organization soldering
    Shinji Fukumoto, Keisuke Yoshida, Yosuke Mizokami, Michiya Matsushima, Kozo Fujimoto
    Materials Transactions,60(6), pp.858-864 (2019).

  4. Electrical property improvement of copper filler conductive adhesive with low-melting point metal bridge
    Michiya Matsushima, Yusuke Takechi, Shogo Minami, Shinji Fukumoto, Kozo Fujimoto
    Materials Transactions,60(9), pp.2016-2021 (2019).

  5. Grain refining in weld metal using short-pulsed laser ablation during CW laser welding of 2024-T3 aluminum alloy
    Masaki Kasuga, Tomokazu Sano, Akio Hirose
    International Journal of Extreme Manufacturing, Vol.1, 045003 (2019).

  6. Improving Fatigue Performance of Laser-Welded 2024-T3 Aluminum Alloy using Dry Laser Peening
    Tomokazu Sano, Takayuki Eimura, Akio Hirose, Yosuke Kawahito, Seiji Katayama, Kazuto Arakawa, Kiyotaka Masaki, Ayumi Shiro, Takahisa Shobu, Yuji Sano
    Metals, Vol.9, 1192-1-14 (2019).

  7. Evaluation of Stiffness-Reduced Joints by Transient Liquid-Phase Sintering of Copper-Solder-Resin Composite for SiC Die-Attach Applications
    Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Yoshihiro Kashiba, Akio Hirose
    IEEE Transaction on Components, Packaging and Manufacturing Technology, Vol.9(10), 2111-2121 (2019).

  8. Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach
    Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
    Applied Sciences, Vol.9(17), 3476 (2019).

  9. Formation Process of the Interface in the Ag/Si Joints by the Decomposition Reaction of Ag2O
    Tomoki Matsuda, Kota Inami, Keita Motoyama, Tomokazu Sano, Akio Hirose
    Journal of Smart Processing, Vol.8(5), pp.177-183 (2019).

  10. Thermal fatigue properties of ultrasonic bonded copper joints
    Takahito Fushimi, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
    Applied Sciences, Vol.9(17), 1556 (2019).

  11. Reliability and temperature resistance of novel solder-metallic mesh composite joints
    Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
    Journal of Electronic Materials, accepted.

  12. High-frequency linear friction welding of aluminum alloys to stainless steel
    Tomoki Matsuda, Hironobu Adachi, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Shozo Ono, Akio Hirose
    Journal of Materials Processing Technology, Vol.269, pp.45-51 (2019).

  13. Evolution of transient liquid-phase sintered Cu-Sn skeleton microstructure during thermal aging
    Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
    Applied Science, Vol.9, 157 (2019).

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 2018
  1. Solderability using thermoset resin-Based solder pastes covered with thermoplastic resin film
    Shinji Fukumoto, Ryoichi Wakimoto, Kohei Yamauchi, Michiya Matsushima, Kozo Fujimoto
    Materials Transactions, 59(8), pp.1359-1366 (2018).

  2. 自己組織化実装法における樹脂特性がソルダフィラー合一挙動に及ぼす影響
    上野 裕輔, 福本 信次, 松嶋 道也, 藤本 公三
    スマートプロセス学会誌, 7(5), pp.192-198 (2018).

  3. Bonding through novel solder-metallic mesh composite design
    Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
    Materials & Design, Vol.160, pp.475-485 (2018).

  4. Relationship between intermetallic compound layer thickness with deviation and interfacial strength for dissimilar joints of aluminum alloy and stainless steel
    Ryoichi Hatano, Tomo Ogura, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
    Materials Science & Engineering A, Vol.735, pp.361-366 (2018).

  5. Improvement of corrosion resistance of AA2024-T3 using femtosecond laser peening without protective and confining medium
    Uroš Trdan, Tomokazu Sano, Damjan Klobčar, Yuji Sano, Janez Grum, Roman ŠturmKeita
    Corrosion Science, Vol.143, 46-55 (2018).

  6. AlN-to-metal direct bonding process utilizing sintering of Ag nanoparticles derived from the reduction of Ag2O
    Keita Motoyama, Tomoki Matsuda, Tomokazu Sano, Akio Hirose
    Journal of Electronic Materials, Vol.47, pp.5780-5787 (2018).

  7. Silver oxide decomposition mediated direct bonding of silicon-based materials
    Tomoki Matsuda, Kota Inami, Keita Motoyama, Tomokazu Sano, Akio Hirose
    Scientific Reports, Vol.8, 10472 (2018).

  8. Femtosecond Laser Peening of Friction Stir Welded 7075-T73 Aluminum Alloys
    Terumasa Kawashima, Tomokazu Sano, Akio Hirose, Seiichiro Tsutsumi, Kiyotaka Masaki, Kazuto Arakawa, Hisashi Hori
    Journal of Materials Processing Technology, Vol.262, pp.111-122 (2018).

  9. Hardening and softening effects in aluminium alloys during high-frequency linear friction welding
    Adrian Lis, Hideo Mogami, Tomoki Matsuda, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Akio Hirose
    Journal of Materials Processing Technology, Vol.255, pp.547-558 (2018).

  10. In-situ study of reduction process of CuO paste and its effect on bondability of Cu-to-Cu joints
    Takafumi Yao, Tomoki Matsuda, Tomokazu Sano, Chiaki Morikawa, Atsushi Ohbuchi, Hisashi Yashiro, Akio Hirose
    Journal of Electronic Materials, Vol.47, pp.2193-2197 (2018).

  11. High frequency linear friction welding of 6063 and 1050 aluminum alloys
    Hideo Mogami, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Ryo Yoshida, Hisashi Hori
    Journal of Light Metal Welding, Vol.56, pp.13-20 (2018).

  12. High-Frequency Linear Friction Welding of Aluminum alloys
    Hideo Mogami, Tomoki Matsuda, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Akio Hirose
    Materials & Design, Vol.139, pp.457-466 (2018).

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Achievements