【Research Subjects】
High Conductivity
Electric and Thermal Conductive Adhesive
with Low-melting-point alloy
Low Temperature Assembly Technology of High Heat Resistant Joint
with Solid-liquid Interdiffusion Phenomenon
Self-organization assembly Technology
of Electronic Devices
Packaging Reliability Evaluation
of Joints in Electronic Devices under Thermal and Mechanical Fatigue Load
Robot Soldering System
with Artifitial Intelligence
Bonding of Organic and Inorganic Materials
in Electronics Packaging
Additive Manufacturing Technology
of 3-D Electronic Circuit